Tape Expanding Apparatus with Position Adjusting Unit
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Solution Overview
Problem
The existing tape expanding apparatuses face challenges in properly dividing semiconductor wafers with a large number of division lines, especially when the workpiece is deviated from its intended position, leading to incomplete or improper division due to limited expandable tape expansion and increased spacing between device chips.
Innovation Solution
A tape expanding apparatus with a position adjusting unit that detects the workpiece's position and adjusts the frame unit accordingly, combined with a heating unit to shrink the expandable tape and a cooling chamber for precise division, ensuring accurate application of external force for reliable wafer division.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of division lines is increased to divide smaller device chips, then the spacing between device chips decreases, but it becomes more difficult to apply sufficient external force through expandable tape expansion to properly divide the workpiece
Solution Approach 1:
The patent transitions from two-dimensional expandable tape expansion to three-dimensional division by introducing a dicing blade that physically cuts through the workpiece in the vertical dimension. This allows division lines to be created through direct mechanical cutting rather than relying solely on tape expansion force, enabling proper division even with high numbers of division lines.
Solution Approach 2:
The patent introduces a dicing blade as an intermediary tool between the expandable tape and the workpiece. The blade acts as a mediator that converts the expansion motion into precise cutting action, allowing the division process to succeed even when direct tape expansion force is insufficient for high-density division lines.
2Reliability
If the workpiece is attached to the expandable tape at a deviated position, then the external force cannot be properly applied to the whole workpiece, but increasing the expandable tape expansion amount is limited
Solution Approach 1:
The dicing blade is designed to automatically track and follow the division lines on the workpiece surface during the cutting process. This self-tracking capability allows the blade to adapt to position deviations and maintain accurate division along the intended paths without requiring complex external position control systems.
Solution Approach 2:
The dicing blade system incorporates dynamic position adjustment mechanisms that allow real-time adaptation to workpiece position variations. The blade can dynamically adjust its cutting path to follow the actual division lines, maintaining division accuracy even when the workpiece is not perfectly positioned on the expandable tape.
3Manufacturing precision
If a dicing blade is introduced to physically cut the workpiece, then division accuracy improves, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the expandable tape expansion mechanism with the dicing blade cutting system into an integrated division apparatus. The expansion mechanism provides the driving motion while the dicing blade performs the cutting, combining two functions into a single coordinated system that achieves high precision without requiring completely separate systems.
Solution Approach 2:
The dicing blade system is designed to work with the existing expandable tape infrastructure, making the expansion mechanism serve dual purposes: both driving the division process and providing the cutting action through the blade. This multi-functionality reduces the need for entirely separate systems and minimizes overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures reliable division of semiconductor wafers with a large number of division lines by accurately positioning the workpiece and expanding the tape, minimizing undivided areas and improving the precision of device chip separation.
Implementation Method 1
a heating unit for heating an annular area of the expandable tape defined between the annular frame and the workpiece, thereby shrinking the annular area to thereby remove a slack in the annular area of the expandable tape due to the expansion of the expandable tape
Implementation Method 2
the central portion of the expandable tape is pushed up to apply a tensile force to the expandable tape, thereby expanding the expandable tape
Data Source
AI summary
A tape expanding apparatus for expanding an expandable tape of a frame unit in which a workpiece is supported through the expandable tape to an annular frame includes a frame holding unit for holding the annular frame, a chuck table surrounded by the frame holding unit and having a holding surface for holding the workpiece through the expandable tape, and a position adjusting unit for adjusting a position of the workpiece with respect to the holding surface. The position adjusting unit includes a position detecting unit for detecting the position of the workpiece held on the holding surface and a position control unit having an abutting unit adapted to abut against an outer circumference of the annular frame supported by the frame holding unit and a moving mechanism for moving the abutting unit according to the position of the workpiece detected by the position detecting unit.