Two-Level Tape Frame Rinse Assembly Wafer Backside Gap
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Solution Overview
Problem
Existing substrate processing equipment faces challenges in rinsing and drying the backside of wafers due to trapped liquid between the wafer and the backside support plate, especially when incoming wafers are already wet.
Innovation Solution
A two-level tape frame rinse assembly is designed to elevate the wafer above the backside support plate, creating a gap that allows for rinsing and spinning dry of the wafer's backside, utilizing a chuck assembly with gripper units and a rotatable backside support plate to manage the wafer's position and access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a backside support plate is used to support fragile substrates during high pressure spraying, then substrate damage is prevented, but liquid becomes trapped between the substrate and support plate preventing effective rinsing
Solution Approach 1:
The support plate is made movable rather than fixed, allowing it to be dynamically adjusted between contact and non-contact positions with the substrate. This enables the system to adapt between providing support during spraying and allowing liquid drainage during rinsing, resolving the contradiction between preventing substrate damage and avoiding liquid trapping.
Solution Approach 2:
The solution introduces vertical movement of the support plate, adding a dimensional aspect to the rinsing process. By moving the support plate vertically away from the substrate, a gap is created that allows liquid to drain from the backside of the substrate, eliminating the liquid trapping problem while maintaining substrate support capability.
2Stability of the object's composition
If the wafer is held in contact with the backside support plate, then stable positioning is achieved, but the backside of the wafer cannot be accessed for rinsing
Solution Approach 1:
The support plate transitions from a static contact surface to a dynamic movable component. It can be positioned to contact the wafer for stable positioning during processing, then moved away to enable backside access for rinsing, allowing the system to switch between stability and accessibility as needed.
Solution Approach 2:
The movable support plate acts as an intermediary that can be selectively engaged or disengaged from the wafer. When engaged, it provides stable positioning; when disengaged, it allows rinsing access. This intermediary mechanism reconciles the conflicting requirements of stability and accessibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents liquid trapping and enables efficient rinsing and drying of the wafer's backside, ensuring effective chemical processing and preventing damage from high-pressure sprays.
Implementation Method 1
create a gap between the wafer and the backside support plate that allows the backside of the wafer to be rinsed and spun dry
Implementation Method 2
spun dry after rinsing
Data Source
AI summary
A two-level tape frame rinse assembly is configured for grasping the substrate so as to create a gap between the substrate and a backside support plate that allows the backside of the wafer to be rinsed and spun dry after rinsing.