Tape Head Module Congruent Extension for 64-Channel Half-High Drives
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Solution Overview
Problem
Tape drives, particularly half-high drives, are limited to 32 data channels due to space constraints, while full-high drives can support more channels, necessitating a solution for interchangeable tape formats between drive sizes.
Innovation Solution
A method of forming tape head modules by rearranging and splitting chips on a rowbar to create congruent segments, allowing for the formation of modules suitable for both half-high and full-high drives, enabling flexible use of 64 channels in half-high drives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If half-high drive design is used to reduce footprint size, then device size is reduced, but channel capacity is limited to 32 channels
Solution Approach 1:
The rowbar is segmented into multiple chips (first chip, second chip, third chip) during fabrication, allowing the elements to be distributed across multiple separate components that can be later reassembled in different configurations to achieve different channel capacities while maintaining the same physical footprint
Solution Approach 2:
The same rowbar design with segmented chips can serve multiple functions - it can be configured to produce half-high drives with 32 channels, half-high drives with 64 channels, or full-height drives with 64+ channels, making the fabrication process universal for different drive types and channel capacities
2Quantity of substance
If full-height drive design is used to increase channel capacity to 64+ channels, then channel capacity is improved, but drive footprint size increases
Solution Approach 1:
By segmenting the rowbar into multiple chips during fabrication, the elements can be distributed across smaller components that can be packed more efficiently in three-dimensional space, enabling high channel capacity in a compact half-height form factor
Solution Approach 2:
The segmented chip architecture enables transition from two-dimensional planar arrangement to three-dimensional stacking and arrangement, allowing more elements to be packed into the same footprint by utilizing vertical and depth dimensions
3Reliability
If separate fabrication processes are used for full-height and half-height drives, then drive-specific optimization is achieved, but manufacturing complexity increases
Solution Approach 1:
A single universal fabrication process is used to create rowbars with segmented chips that can be configured for different drive types, eliminating the need for separate fabrication lines while maintaining optimization for each specific application through post-fabrication configuration
Solution Approach 2:
The same fabrication process can produce different drive configurations by changing parameters such as the number of chips per rowbar, the arrangement pattern, and the bonding configuration, allowing flexible adaptation to different drive requirements without process changes
4Manufacturing precision
If rowbar elements are centered on each chip during fabrication, then manufacturing precision is improved, but channel capacity in half-height drives is limited
Solution Approach 1:
By centering elements on each individual chip segment rather than on the entire rowbar, the manufacturing process maintains high precision for each chip while the segmented architecture enables higher overall channel capacity through distributed element placement across multiple chips
Data Source
AI summary
The present disclosure generally relates to a tape drive comprising one or more tape head modules and a method of forming thereof. A first element array and a second element array are disposed on a first chip of a rowbar, and a third element array and a fourth element array are disposed on a second chip of the rowbar. The second element array is centered on the first chip, and the fourth element array is centered on the second chip. The rowbar is split to separate the first and second chips, and the first and second chips are re-arranged before being bonded to a u-beam. The u-beam is split to form a first tape head module and a second tape head module. The first tape head module comprises the second chip and a congruent segment of the first chip. The second tape head module comprises the first chip.