Tape and Reel Packing Material Restriction Structures

Solution Overview

Problem

Conventional tape and reel packing materials cause chip damage due to collisions with recess walls during transportation and inadequate attachment of the cover tape, leading to chips becoming jammed or separated.

Innovation Solution

The tape and reel packing material incorporates a cover tape with restriction structures, including central and peripheral restriction portions, to limit chip movement, preventing collisions and separation by attaching to the carrier tape via specific attachment areas with adhesive layers and substrate configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the recess space is large to accommodate the chip, then the chip can be easily placed, but the chip collides against the inner wall during transportation and becomes damaged

Engineering Contradiction:
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The recess is segmented into multiple functional zones: a first recess portion for chip placement, a second recess portion with restricted space to prevent movement, and a guiding slope to guide the chip into position. This segmentation allows the chip to be easily placed while preventing collision damage during transportation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the recess have different spatial characteristics optimized for specific functions: the first recess portion has sufficient space for easy chip placement, while the second recess portion has restricted space to prevent chip movement and collision, and the guiding slope has a specific angle (65-85 degrees) to facilitate chip insertion.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If the cover tape is not sufficiently attached to the carrier tape, then the assembly is easier to manufacture, but the chip may leave the recess and get jammed between the cover tape and carrier tape

Engineering Contradiction:
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The cover tape is pre-attached to the carrier tape in the attachment area before the chips are placed in the recesses. This preliminary attachment ensures that the cover tape maintains proper positioning relative to the carrier tape, preventing chips from leaving the recesses and getting jammed during subsequent handling and transportation.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The recess structure acts as an intermediary mechanism between the cover tape and carrier tape. By providing physical constraints through the recess walls and the second recess portion, the structure prevents direct contact and potential jamming of chips between the cover tape and carrier tape, while still maintaining adequate attachment.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the cover tape is fully attached to the carrier tape, then the chip is securely held, but the manufacturing process becomes more complex

Engineering Contradiction:
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The cover tape is divided into distinct functional areas: an attachment area for bonding to the carrier tape and a restriction area with recesses for chip containment. This segmentation allows the attachment process to be localized to specific regions, simplifying manufacturing while ensuring reliable chip security through the recess structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The attachment properties are localized to the attachment area where the cover tape bonds to the carrier tape, while the restriction area maintains structural features (recesses with guiding slopes) that provide chip containment. This local differentiation of properties enables secure chip holding without requiring complex full-surface attachment.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10336523B2Tape and reel packing material
Publication Date: 2019.07.02
  • US10336523B2 patent drawing
  • US10336523B2 patent drawing
  • US10336523B2 patent drawing

AI summary

A tape and reel packing material for packaging a plurality of chips is provided. The tape and reel packing material includes a carrier tape and a cover tape. The carrier tape includes a plurality of recesses. The recesses are configured to receive the chips respectively. The cover tape is attached to the carrier tape. The cover tape includes a plurality of restriction structures, and the restriction structures respectively are inserted into the recesses to restrict the freedom of the movement of the chips.