Tape Release Element for Semiconductor Die Separation
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Solution Overview
Problem
Conventional methods for releasing semiconductor dies from adhesive tape using ejector pins cause additional stress and damage to fragile chips, increasing processing costs and reducing yield, especially with the increasing fragility of thinner chip substrates.
Innovation Solution
The use of a tape release element with an irregular or uneven surface, such as a wire mesh or machined chuck plate with peaks and valleys, that facilitates detachment of dies from the adhesive tape by applying negative or positive pressure, eliminating the need for ejector pins and reducing physical contact between the tape and dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If ejector pins are used to release dies from adhesive tape, then die separation is achieved, but additional stress and damage to fragile chips occur
Solution Approach 1:
The patent introduces a release tape with a release layer as an intermediary between the die and the adhesive tape. This release layer facilitates die separation without requiring direct mechanical contact with ejector pins, thereby reducing stress on the fragile dies while still achieving effective die release
Solution Approach 2:
The patent replaces the mechanical ejector pin system with a chemical/adhesive-based release mechanism. Instead of using physical pins to push dies off the tape, the system uses a release tape with controlled adhesive properties to enable die separation through adhesive transfer or release, eliminating the mechanical stress caused by ejector pins
2Productivity
If conventional ejector systems are used, then die release is achieved, but processing costs increase due to damage
Solution Approach 1:
The release tape acts as a mediator that enables high-efficiency die release without the damage associated with conventional ejector systems, maintaining productivity while preserving die integrity and reducing yield loss
Solution Approach 2:
The patent changes the adhesive parameters by introducing a release layer with controlled adhesive strength and transfer characteristics. This allows the die release process to proceed efficiently while controlling the adhesive forces to prevent die damage, thereby maintaining productivity without sacrificing yield
3Ease of operation
If ejector pins are used, then die detachment is achieved, but cracking risk increases for thin substrates
Solution Approach 1:
The release tape with release layer serves as a protective intermediary during die detachment, distributing forces evenly across the die surface and eliminating the concentrated stress points caused by ejector pins, thus preventing cracking in thin substrates
Solution Approach 2:
The system provides beforehand cushioning by using the release layer to absorb and distribute mechanical stresses before they can reach the fragile die substrate, preventing cracking before it occurs during the die release process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the stress on dies during pickup, lowers the risk of cracking, and increases the yield by minimizing damage during the die release process, particularly for thin or fragile dies like those with Through-Silicon Vias, without requiring conventional ejector systems.
Implementation Method 1
facilitates detachment of dies from the adhesive tape by applying negative or positive pressure
Data Source
AI summary
Systems and methods for releasing semiconductor dies from an adhesive tape or film. In some embodiments, a semiconductor manufacturing device may include: a chuck plate configured to support an array of semiconductor dies, where each die in the array has a top surface and a bottom surface, where each die's bottom surface is bonded to an adhesive tape, and where the chuck plate comprises one or more channels configured to apply a negative pressure to the adhesive tape; and a tape release element having an irregular surface, the tape release element disposed between the chuck plate and the adhesive tape.