Tape Temperature Adjustment for Substrate Stress
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Solution Overview
Problem
During semiconductor and liquid crystal display manufacturing processes, stress occurs in substrates due to temperature differences between layers, leading to deformation, which existing technologies fail to effectively mitigate.
Innovation Solution
A substrate treating apparatus and method involving a tape supply system, where a tape is attached to the substrate with a temperature adjustment mechanism to counteract stress by expanding or contracting in opposition to the substrate layers, thereby reducing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a tape is attached to a substrate to counteract stress, then substrate deformation is reduced, but the tape undergoes contraction or expansion over time which affects attachment stability
Solution Approach 1:
The tape is pre-adjusted to a specific temperature state before attachment to the substrate. This preliminary temperature adjustment ensures that the tape undergoes contraction or expansion over time in a controlled manner, allowing it to effectively counteract substrate deformation while maintaining stable attachment. The pre-adjustment action prevents future attachment failures by anticipating the thermal behavior of the tape.
Solution Approach 2:
The invention changes the temperature parameter of the tape before attachment. By controlling the tape's temperature state, the physical properties of the tape (such as its dimensional stability and stress characteristics) are modified. This parameter change enables the tape to undergo controlled contraction or expansion over time, which counteracts substrate deformation while maintaining reliable attachment.
2Stability of the object's composition
If the tape is adjusted to a specific temperature state before attachment, then the tape can effectively counteract substrate stress, but additional temperature adjustment equipment and process steps are required
Solution Approach 1:
A temperature adjustment member is introduced as an intermediary component between the tape supply member and the substrate. This mediator adjusts the temperature of the tape to a predetermined state before attachment, enabling the tape to undergo controlled contraction or expansion. The intermediary approach simplifies the overall system by concentrating the temperature control function in a dedicated component rather than requiring complex integrated control.
Solution Approach 2:
The temperature adjustment member performs the temperature adjustment action in advance, before the tape is attached to the substrate. This preliminary action ensures that the tape is in the optimal temperature state for counteracting substrate stress, while allowing the main substrate treatment process to proceed without continuous temperature intervention.
3Device complexity
If existing technologies are used without temperature adjustment, then the process is simpler, but substrate deformation occurs due to temperature differences between layers
Solution Approach 1:
The invention changes the temperature parameter of the tape as a key control variable. By adjusting the tape's temperature before attachment, the physical and mechanical properties of the tape are optimized to counteract substrate deformation. This single parameter change (temperature) provides an effective solution to the substrate shape precision problem without requiring fundamental process redesign.
Solution Approach 2:
The invention exploits the thermal expansion and contraction properties of the tape material. By controlling the tape's temperature state, the tape undergoes predictable dimensional changes over time that counteract the substrate deformation caused by temperature differences between layers. This thermal effect is harnessed as a beneficial mechanism rather than a nuisance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces substrate deformation by using a thermally adjusted tape that expands or contracts to offset stress forces, ensuring more stable processing conditions.
Implementation Method 1
a tape that is in a state where the tape undergoes contraction or expansion as time passes
Implementation Method 2
adjusting a temperature of the tape that is supplied from the tape supply member to the support member
Data Source
AI summary
An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.