Tapered Coil Pattern Dry Etching for Low Resistance
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Solution Overview
Problem
Existing coil component manufacturing methods face limitations in miniaturization due to shape changes and electrical characteristic losses during the etching process, particularly in forming micro line widths less than 10 μm, which restricts the reduction of electrical resistance and inductance.
Innovation Solution
The coil component employs a tapered coil pattern with a vertical region and a seed region, formed using dry etching to maintain the cross-sectional area and reduce parasitic capacitance, allowing for reduced electrical resistance and enhanced inductance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet etching method is used to form coil pattern, then seed layer can be removed, but coil shape changes and electrical characteristics are lost
Solution Approach 1:
The patent replaces wet etching (chemical/mechanical process) with dry etching (physical sputtering process) to remove the seed layer. This substitution eliminates the harmful chemical interaction that causes coil pattern degradation, achieving both seed layer removal and preservation of coil shape accuracy.
Solution Approach 2:
The patent introduces a protective layer as an intermediary between the coil pattern and the etching process. This protective layer shields the coil pattern from direct exposure to etchants, preventing shape changes and electrical characteristic loss while allowing selective removal of the seed layer.
2Ease of manufacture
If photoresist technique is used to form coil pattern, then pattern can be formed, but width reduction is limited
Solution Approach 1:
The patent replaces the photoresist technique (chemical process) with direct dry etching or lift-off techniques. This substitution removes the inherent resolution limits of photoresist, enabling precise control of line widths at the micrometer and sub-micrometer scale without compromising pattern formation capability.
3Volume of moving object
If coil pattern size is reduced, then miniaturization is achieved, but electrical resistance increases
Solution Approach 1:
The patent changes the cross-sectional geometry parameters of the coil pattern, specifically implementing a tapered structure where the width varies along the height. This parameter optimization allows reduced overall size while maintaining adequate cross-sectional area for low electrical resistance through the tapered geometry that concentrates conductive material where most needed.
Solution Approach 2:
The patent employs composite structures combining multiple materials with different properties - such as high-conductivity metal fillers in a polymer matrix, or layered metal compositions - to achieve both miniaturization and maintained electrical conductivity. The composite structure allows size reduction while compensating for resistance increases through material property optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of micro coil patterns with low electrical resistance and reduced parasitic capacitance, improving the coil component's performance and size reduction while minimizing shape changes and electrical losses.
Implementation Method 1
the coil pattern is formed by forming a seed layer on a substrate, forming a conductive pattern using plating
Implementation Method 2
it has been suggested to use a dry etching method in order to minimize changes in a shape of the coil pattern and losses of electrical characteristics of the coil
Data Source
AI summary
A coil component includes a substrate and a coil pattern disposed on the substrate. The coil pattern includes a vertical region having a side surface perpendicular with respect to the substrate and a tapered region connected to the vertical region and having a side surface inclined with respect to the substrate.