Tapered Die Connector Package Structure for Bubble-Free Encapsulation
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Solution Overview
Problem
The formation of bubbles during the packaging process of semiconductor components due to the use of high-viscosity polymers and vertical conductive connectors, which can damage the package during thermal processes, is a challenge in the semiconductor industry.
Innovation Solution
The formation of taper-shaped conductive connectors and die connectors prevents bubble formation by allowing high-viscosity polymers to fill the spaces between connectors without issues, achieved through specific etching processes to create a tapered profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical conductive connectors are used with high-viscosity polymers during packaging, then the connectors provide strong electrical connection, but bubbles form during encapsulation that can damage the package during thermal processes
Solution Approach 1:
The conductive connectors are changed from vertical cylindrical shape to tapered shape with asymmetric profile. The tapered shape has a wider opening at one end and a narrower base at the other end, creating an asymmetric geometry that prevents bubble entrapment during polymer encapsulation while maintaining electrical connectivity
Solution Approach 2:
The geometric parameters of the conductive connectors are modified by changing from a uniform vertical cylinder to a tapered configuration. This parameter change in shape and orientation allows the high-viscosity polymer to flow around the connectors without trapping bubbles, while the connectors still provide the necessary electrical connection
2Strength
If high-viscosity polymers are used for encapsulation, then the polymer provides good structural support, but the polymer cannot effectively fill spaces between vertical connectors, leading to bubble formation
Solution Approach 1:
The tapered shape of the conductive connectors creates an asymmetric geometry with a wider opening and narrower base. This asymmetric configuration allows high-viscosity polymer to flow into the spaces between connectors from the wider opening side, preventing bubble entrapment while maintaining the structural support function
Solution Approach 2:
The tapered shape introduces curvature variation along the connector length, transitioning from a straight vertical cylinder to a curved tapered form. This curvature change facilitates polymer flow around the connectors by creating a gradual transition zone that prevents bubble formation during encapsulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents bubble formation during the encapsulation process, ensuring the integrity and reliability of semiconductor packages by allowing polymers to fill gaps effectively, thereby reducing damage from thermal expansion.
Implementation Method 1
achieved through specific etching processes to create a tapered profile
Data Source
AI summary
Provided is a package structure including a first die and an encapsulant. The first die includes a substrate, a plurality of pads over the substrate, a passivation layer on portions of each of the plurality of pads, a plurality of first die connectors on the plurality of pads, respectively and a dielectric layer laterally encapsulating the plurality of first die connectors. The encapsulant laterally encapsulates the first die. One of the plurality of first die connectors is a taper-shaped die connector. A width of the one of the plurality of first die connectors gradually increases from a top surface of the one of the plurality of first die connectors toward the a top surface of the passivation layer.