Tapered Flared Substrate Separation Tool for Scratch-Free Interface
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Solution Overview
Problem
Existing devices struggle to separate substrates of large dimensions or with high bonding energy without scratching, contaminating, or inadvertently rejoining them, particularly in applications involving electronics, optics, and photovoltaics.
Innovation Solution
A separation device featuring a tapered and flared leading edge with a specific angle and shape, combined with a retaining member and moving means, allows for controlled separation along a separation interface, minimizing surface contact and ensuring perpendicular force application to prevent damage and rejoining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a thin blade is inserted between two substrates to measure bonding energy, then the bonding energy can be determined, but the blade may cause scratches on the bonded faces of the substrates
Solution Approach 1:
The patent introduces a liquid promoter as an intermediary substance between the blade and the substrate surfaces. This liquid facilitates the separation process by reducing the bonding energy at the interface, allowing the blade to insert and separate substrates without directly scratching the bonded faces. The liquid acts as a mediator that enables measurement while protecting the surfaces.
2Manufacturing precision
If substrates of large dimensions or with high bonding energy are separated, then complete separation can be achieved, but the separation becomes more difficult and may cause damage
Solution Approach 1:
The patent changes the physical-chemical parameters at the separation interface by introducing a liquid promoter that modifies the bonding energy characteristics. This liquid alters the interface properties to reduce bonding strength locally, making separation of large or high-bonding-energy substrates feasible without excessive force that would cause damage.
Solution Approach 2:
The liquid promoter serves as a mediator between the blade and the substrate interface, facilitating the separation process for difficult substrates by chemically or physically reducing the bonding energy at the interface, thereby enabling complete separation without damage.
3Force
If a blade with large contact area is used to separate substrates, then separation force is distributed, but the blade may inadvertently push the substrates back together
Solution Approach 1:
The patent employs a blade with a curved or rounded leading edge instead of a flat surface. This curvature allows the blade to penetrate between the substrates more effectively, applying force in a way that maintains separation rather than pushing substrates back together. The curved geometry concentrates force at the tip while distributing it along the separation path.
4Reliability
If the bonding interface is strengthened to ensure牢固 bonding, then substrate attachment is more reliable, but separation becomes more difficult and may cause damage
Solution Approach 1:
The liquid promoter acts as a temporary intermediary that selectively reduces bonding energy at the separation interface without affecting the overall bonding reliability during the bonding process. It enables controlled separation by modifying only the interface properties at the moment of separation, allowing strong bonding during use and clean separation when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient separation of substrates up to 300 mm in diameter with high bonding energy without damage, ensuring clean and complete separation while preventing accidental rejoining.
Implementation Method 1
a separation device featuring a tapered and flared leading edge with a specific angle and shape, combined with a retaining member and moving means, allows for controlled separation along a separation interface, minimizing surface contact and ensuring perpendicular force application to prevent damage and rejoining
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The invention relates to a device for separating a structured formed by two substrates, at a separation interface, said device comprising: a support (1); a structure-retaining member (2) mounted on the support (1); a tool (3) for separating the two substrates, also mounted on the support (1); means (4) for moving the separating tool (3) and/or means (5) for moving the retaining member (2) in relation to the support (1), such that they are moved towards or away from one another, preferably over a limited travel. The device is characterised in that the separating tool (3) comprises a leading edge (30) having, in cross-section and located rearwards from the top or front edge (323), a tapered portion (32) extending into a flared portion (33). The invention is suitable for substrates used in electronics, optics, optoelectronics and/or photovoltaics.