Tapered Floating Electrode Ring for Plasma Uniformity
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Solution Overview
Problem
Existing substrate processing apparatuses face issues due to changes in the shape, surface roughness, and height of rings surrounding the electrostatic chuck, which affect plasma shape and reduce the yield of the etching process, leading to defects in semiconductor devices.
Innovation Solution
The substrate processing apparatus includes a floating electrode with a tapered shape and a ring structure that prevents physical and electrical contact, maintaining a uniform plasma shape and improving the yield by using materials with higher corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ring structure is used to surround the electrostatic chuck, then the substrate can be processed with plasma, but the ring shape, surface roughness, and height change over time, affecting plasma uniformity
Solution Approach 1:
The ring is divided into multiple segments that can be independently replaced. When one segment becomes worn or deformed, only that specific segment needs to be replaced rather than the entire ring, maintaining consistent plasma shape and processing reliability.
Solution Approach 2:
The ring structure is designed to be dynamically replaceable with adjustable segments. This allows the system to adapt to wear and deformation by swapping segments, maintaining optimal plasma uniformity throughout the ring's operational life.
2Productivity
If the ring structure is used, then plasma generation is enabled, but the changing ring characteristics reduce etching yield and cause semiconductor device defects
Solution Approach 1:
Multiple ring segments are pre-manufactured with precise dimensions and stored for replacement. Before degradation affects etching quality, worn segments are proactively replaced with fresh ones, preventing yield reduction and defect formation in semiconductor devices.
Solution Approach 2:
The ring segments are designed with optimized geometric parameters including specific height, radius, and surface finish characteristics. By maintaining consistent parameters through replacement rather than continuous use, the plasma uniformity and etching precision are preserved.
3Reliability
If a floating electrode with tapered shape is used, then plasma shape uniformity is improved, but the device complexity increases
Solution Approach 1:
The tapered shape is applied locally to specific portions of the floating electrode rather than the entire structure. This localized tapering achieves plasma uniformity where needed while keeping other portions simple, balancing performance improvement with structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution generates a uniform plasma shape, reduces the inclination of etching holes, and increases the lifespan of components, thereby enhancing the yield and quality of the substrate processing process.
Implementation Method 1
an electrostatic chuck (ESC) configured to mount or accommodate a substrate thereon
Implementation Method 2
process the substrate using plasma
Data Source
AI summary
A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.