Tapered Guide Mechanism for Vertical Semiconductor Test Socket Alignment
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Solution Overview
Problem
In semiconductor testing using vertical type handlers, the weight of ICs under test causes downward displacement due to gravity, leading to contact issues between the IC's external contact terminal and the test socket, resulting in inefficient testing and potential damage.
Innovation Solution
A semiconductor test apparatus with a test socket and semiconductor transport fixture featuring a tapered position adjustment guide and guide through bore, which securely maintains contact between the test socket's contact pin and the IC's external contact terminal by guiding the IC upward, preventing horizontal and vertical displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If vertical type handlers are used to reduce installation space, then the space per handler is reduced, but the ICs under test drop downward due to gravity causing displacement and contact failure
Solution Approach 1:
The tapered guide structure is prepared in advance within the transport fixture. When the IC is mounted, the taper automatically guides it into the correct position before testing begins, preventing gravity-induced displacement during vertical handling.
Solution Approach 2:
The guide structure uses a tapered geometry where the cross-sectional area varies along the length. This parameter change creates a self-aligning mechanism that compensates for gravitational effects and maintains proper IC positioning during vertical transport and testing.
2Reliability
If the concave portion size is made the same as IC size to prevent displacement, then contact reliability is improved, but mounting and dismounting becomes extremely difficult
Solution Approach 1:
The concave portion has non-uniform dimensions with a tapered guide section and a larger receiving area. The local quality varies along the structure - narrower at the entrance for easy insertion, and sized appropriately at the bottom for stable IC holding and reliable contact.
Solution Approach 2:
Instead of making the entire concave portion tight-fitting, the design inverts the approach by using a tapered expansion from narrow to wide. This allows easy mounting at the narrow end while maintaining secure holding at the wider base.
3Reliability
If the IC is pushed toward the test socket while kept in contact with the lower end of the concave portion, then contact between contact pin and external contact terminal is achieved, but the external contact terminal hits the insert edge and gets damaged
Solution Approach 1:
The tapered guide structure acts as an intermediary between the IC and the insert edge. It provides a controlled path for the IC during pushing, guiding it smoothly toward the test socket without direct contact with the sharp insert edge, thus preventing damage.
Solution Approach 2:
The tapered geometry provides a gradual transition zone that cushions the IC during the pushing operation. This prevents sudden impacts with the insert edge by distributing the force over a longer distance and controlling the IC's movement path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable contact between the test socket's contact pin and the IC's external contact terminal, enhancing testing efficiency and preventing damage during vertical handling.
Implementation Method 1
the weight of ICs under test causes downward displacement due to gravity
Data Source
AI summary
A semiconductor test apparatus capable of securely having the contact pin and the external contact terminal held in contact with each other even in case where the vertical type handler is used. The semiconductor test apparatus comprises: a test socket having a socket surface formed thereon, the socket surface having a contact pin towering therefrom; and a semiconductor transport fixture having a concave portion formed thereon, the concave portion adapted to receive therein an IC under test, wherein the test socket has a position adjustment guide provided thereon, the semiconductor transport fixture has a guide through bore formed therein, the guide through bore adapted to receive the position adjustment guide therethrough when the IC under test comes under test, and either one of the position adjustment guide or the guide through bore is formed in a tapered shape.