Tapered Interconnect Wires for Lower RC Delay and Power

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Solution Overview

Problem

In high-speed data buses within VLSI chip designs, legacy architectures face challenges in minimizing power consumption and area overhead due to high power requirements and spacing needs related to RC delay and parasitic capacitance, which can lead to significant power and space consumption on the chip.

Innovation Solution

The implementation of tapered interconnect wires, where the width of the wire changes progressively between repeater stations, reducing wire-to-wire capacitance and allowing for increased resistance without significantly increasing RC delay, thereby minimizing power consumption and area overhead.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If repeaters are employed at regular intervals with low-impedance higher-level metal wires to optimize delay and power parameters, then signal transmission reliability is improved, but power consumption and area overhead increase

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The wire width is made non-uniform along its length, with different sections having different widths. The first section adjacent to the first repeater has a greater width than the second section adjacent to the second repeater, creating local variations in electrical characteristics that reduce overall power consumption while maintaining signal integrity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The wire's physical parameter (width) is changed along its length to optimize performance. By tapering the wire width from the first section to the second section, the invention achieves reduced capacitance and optimized RC delay characteristics, resulting in lower power consumption without sacrificing signal transmission reliability.

Inventive Principle:
Principle #35Parameter changes

2Speed

If non-minimum wire width and spacing are used to reduce RC delay impact, then signal transmission speed is improved, but area overhead increases

Engineering Contradiction:
Improvesignal transmission speedVSAvoidarea overhead
Core Design Contradiction:
SpeedVSArea of stationary object

Solution Approach 1:

Different sections of the wire have different widths optimized for their specific functions. The first section has greater width to reduce RC delay near the first repeater, while the second section has reduced width to minimize area overhead, achieving both speed improvement and area efficiency through localized optimization.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The wire is divided into distinct sections with different width characteristics. This segmentation allows each section to be optimized independently - the first section for speed performance and the second section for area efficiency - thereby achieving both objectives simultaneously.

Inventive Principle:
Principle #1Segmentation

3Loss of energy

If wire width is reduced to decrease wire-to-wire capacitance, then power consumption is reduced, but resistance increases significantly

Engineering Contradiction:
Improvepower consumptionVSAvoidresistance control
Core Design Contradiction:
Loss of energyVSManufacturing precision

Solution Approach 1:

The wire width is optimized locally in different sections. The first section maintains greater width to control resistance, while the second section has reduced width to decrease capacitance and power consumption. This local quality variation allows the system to achieve low power consumption without excessive resistance increase.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The wire's cross-sectional dimension is made dynamic rather than uniform, varying along the length to balance resistance and capacitance effects. This dynamic geometry allows the wire to achieve optimal electrical characteristics for power reduction while maintaining acceptable resistance levels through the wider first section.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS20230275078A1Tapered interconnect wires
Publication Date: 2023.08.31 INTEL CORP
  • US20230275078A1 patent drawing
  • US20230275078A1 patent drawing
  • US20230275078A1 patent drawing

AI summary

Embodiments herein relate to an interconnect that includes a first repeater, a second repeater, and a wire configured to carry an electrical signal from the first repeater to the second repeater. The wire may have a measurement adjacent to the first repeater that is greater than a measurement of the wire adjacent to the second repeater. Other embodiments may be described and claimed.