Tapered Element Structure for Semiconductor Embedding and Protection
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Solution Overview
Problem
Recent semiconductor devices face challenges in improving embeddability around element parts on a substrate, which affects the integration and protection of these parts.
Innovation Solution
The semiconductor device includes element parts with a design where at least a part of the element part is shaped to increase in width toward the substrate, featuring a side wall made of inorganic materials like SiN, and an embedded layer, with a protective film covering the elements, enhancing embeddability and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If element parts are designed with conventional shapes, then manufacturing is simpler, but embeddability around the element parts deteriorates
Solution Approach 1:
The element part is designed with an asymmetric tapered shape where the width increases toward the substrate. This asymmetric geometry creates a stepped structure that naturally improves embeddability by allowing the embedded layer to be formed at different levels, resolving the contradiction between simple manufacturing and improved embeddability.
Solution Approach 2:
The invention introduces a dimensional change by tapering the element part in the thickness direction (width increasing toward the substrate). This creates a three-dimensional stepped structure that enhances embeddability without complicating the fundamental manufacturing process, as the tapered shape can be integrated into existing fabrication flows.
2Reliability
If protective films are added to cover element parts, then protection against moisture and dust improves, but device complexity increases
Solution Approach 1:
The protective film is merged with the embedded layer structure. The embedded layer serves dual functions: it provides the stepped geometry for improved embeddability and simultaneously acts as a protective barrier against moisture and dust. This merging reduces overall device complexity while maintaining protection.
Solution Approach 2:
The embedded layer is designed to perform multiple functions: it provides mechanical support, creates the tapered geometry for embeddability, and serves as a protective film against environmental factors. This multi-functionality reduces the need for separate protective structures, thereby reducing device complexity.
3Manufacturing precision
If side walls are formed with etching, then embeddability improves, but manufacturing precision requirements increase
Solution Approach 1:
The side wall formation utilizes parameter changes in the etching process, specifically controlling the etch depth and angle to create the tapered shape. By optimizing etching parameters such as depth and selectivity, the patent achieves improved embeddability while keeping the manufacturing process within standard capabilities.
Data Source
AI summary
Provided is a semiconductor device that can improve embeddability around an element part provided on a substrate.The semiconductor device according to the present technique includes the substrate and the at least one element part provided on the substrate. At least a part of the element part is shaped to increase in width toward the substrate, the part including a side opposite to a side near the substrate. According to the semiconductor device of the present technique, the semiconductor device can be provided with enhanced embeddability around the element part provided on the substrate.