Tapered SOI Optical Waveguide Core Layer Constriction

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Solution Overview

Problem

Conventional methods for producing SOI optical waveguides with spot size conversion are complex due to separate processes for constraining waveguide width and thickness, leading to increased optical propagation losses.

Innovation Solution

A method to simultaneously constrict both the width and thickness of the SOI optical waveguide core layer using a single process, employing a silicon nitride film as a mask for LOCOS oxidation, allowing for a tapered waveguide structure that reduces optical losses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If separate processes are used to constrict waveguide width and thickness, then manufacturing precision can be maintained, but device complexity and production time increase

Engineering Contradiction:
Improvewaveguide dimensionsVSAvoidproduction process
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the width constriction and thickness reduction processes into a single integrated process. The mask layer is patterned with a tapered profile that simultaneously defines both the width and thickness of the waveguide core layer, eliminating the need for separate etching and thinning processes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mask layer is formed with a predetermined tapered profile before the constriction process. This preliminary structuring of the mask layer with the desired final waveguide geometry allows both width and thickness to be controlled in one subsequent processing step.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If multiple processes are used for width and thickness constriction, then manufacturing precision can be maintained, but productivity decreases

Engineering Contradiction:
Improvewaveguide dimensionsVSAvoidproduction speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple constriction operations into a single process step by using a pre-patterned mask layer with tapered geometry, thereby reducing the total number of processing steps and increasing production efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mask layer is prepared in advance with the exact tapered profile needed, so that the subsequent single processing step can simultaneously achieve both width and thickness constriction without requiring multiple sequential operations.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If etching process is used to constrict waveguide width, then manufacturing precision can be achieved, but optical propagation losses increase

Engineering Contradiction:
Improvewaveguide widthVSAvoidoptical propagation losses
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent introduces a mask layer as an intermediary element that defines the waveguide geometry. Instead of directly etching the waveguide core to constrict its width, the mask layer with tapered profile is used to guide the constriction process, reducing direct damage to the waveguide core and minimizing optical propagation losses.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the production process, reduces optical coupling losses, and minimizes propagation losses by forming a tapered waveguide without damaging the silicon layer, enabling low-cost, high-yield spot size conversion.

Implementation Method 1

the width of the first core layer is defined based on the width of an unoxidized semiconductor material sandwiched between oxide films the parts of which are thermally oxidized; the thickness of the first core layer is defined based on the thickness of an unoxidized semiconductor material sandwiched between the first clad layer and an oxide film the part of which is thermally oxidized

Methodology Applied
Scientific EffectThermal oxidation: Oxidation

Data Source

PatentUS8126301B2Optical waveguide and method for producing the same
Publication Date: 2012.02.28 NEC CORP
  • US8126301B2 patent drawing
  • US8126301B2 patent drawing
  • US8126301B2 patent drawing

AI summary

Provided are an optical waveguide and a production method thereof which can constrict both the width and thickness of the SOI optical waveguide core layer in the same process and at the same time, simplify production process, and reduce optical losses. An optical waveguide includes a first clad layer formed on a semiconductor substrate; a first core layer formed on the upper side of the first clad layer with the use of a semiconductor material the refractive index of which is higher than that of the first clad layer; and a second clad layer formed on the upper side of the first core layer with the use of a material the refractive index of which is lower than that of the first core layer. The width of the first core layer is defined based on the width of an unoxidized semiconductor material sandwiched between oxide films the parts of which are thermally oxidized. The thickness of the first core layer is defined based on the thickness of an unoxidized semiconductor material sandwiched between the first clad layer and an oxide film the part of which is thermally oxidized. At least the input/output portion of the optical waveguide has a tapered waveguide portion where the width and thickness of the first core layer monotonically decreases or increases with respect to the propagation direction of light.