Tapered Support Pillars for Tire Pressure Detector Assembly
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Solution Overview
Problem
Conventional tire pressure monitoring systems face inefficiencies in the assembly process due to the need for adhesive bonding and curing, which prolongs work time and complicates the fixing of electronic components within the tire pressure detector.
Innovation Solution
The pressure detector is assembled using support pillar members with tapered ends that function as wedge-shaped holding members, inserted into mounting holes on the circuit board, and a packing that separates the detection aperture from the resin flow line, allowing for secure fixation and stabilization of components without adhesive bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding is used to fix the cap member on the sensor IC, then the detection aperture is protected from being buried in the potting compound, but additional work time is required for bonding and curing
Solution Approach 1:
The patent replaces the adhesive bonding system with a mechanical positioning system. The cap member is provided with a positioning protrusion that fits into a corresponding positioning groove on the sensor IC, enabling mechanical fixation without adhesives. This eliminates the curing time required for adhesive bonding while maintaining the protective function of the cap member.
Solution Approach 2:
The patent extracts the adhesive bonding step from the assembly process by implementing a purely mechanical positioning and fixation mechanism. The positioning protrusion and groove structure allows the cap member to be securely attached without any adhesive material, thereby removing the time-consuming bonding and curing operations.
2Ease of manufacture
If a cap member with adhesive bonding is used to protect the sensor IC, then the detection aperture remains accessible, but the assembly process becomes more complex and time-consuming
Solution Approach 1:
The patent substitutes the adhesive bonding process with a mechanical interlocking system consisting of a positioning protrusion on the cap member and a corresponding positioning groove on the sensor IC. This mechanical system simplifies the assembly process by eliminating adhesive application and curing steps, making the manufacturing process more efficient and less complex.
Solution Approach 2:
The positioning protrusion and groove structure enables self-aligning and self-fixing of the cap member during assembly. The mechanical features guide the cap member into the correct position and secure it automatically without requiring additional bonding operations, thereby simplifying the manufacturing process and reducing assembly time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the circuit board and electronic components, prevents resin leakage, and significantly reduces assembly time, enabling a more efficient and streamlined assembly process.
Implementation Method 1
support pillar members standing on the bottom surface of the case and each including a tapered portion at an end of each of the support pillar members, the tapered portion becoming thinner toward the end
Data Source
AI summary
A pressure detector includes: a case provided with a hole portion; support pillar members standing on the bottom surface of the case and each including a tapered portion at an end of each of the support pillar members; a circuit board including a sensor having a detection aperture, and mounting holes into which the respective tapered portions are insertable; and a packing provided with a through hole. The case and the circuit board are fixed by a cured resin while the hole portion is connected to the detection aperture via the through hole by inserting the tapered portion of each of the support pillar members into the mounting hole of the circuit board and by sandwiching the packing between the bottom surface of the case and the sensor.