Interconnection Substrate With Tapered Through-Holes
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Solution Overview
Problem
Conventional interconnection substrates face challenges in miniaturizing through-hole interconnections due to fixed separation distances required for maintaining differential impedance, leading to increased footprint and reduced high-density mounting capabilities.
Innovation Solution
The substrate incorporates through-hole interconnections with narrow portions, allowing for a reduced separation distance while maintaining differential impedance by adjusting the capacitive and inductive properties, achieved through sandblasting techniques to form through holes with varying diameters within the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If through-hole interconnections are formed with standard diameter throughout the substrate, then manufacturing is simpler, but the separation distance must be large to maintain differential impedance, increasing footprint
Solution Approach 1:
The through-hole interconnections are designed with different diameters at different locations: larger diameter at the first surface, smaller diameter at the second surface. This local variation in geometry allows the separation distance between adjacent through-holes to be reduced while maintaining the required differential impedance, thereby reducing the substrate footprint without excessive manufacturing complexity
Solution Approach 2:
The diameter parameter of the through-hole interconnections is changed along the depth of the substrate. By transitioning from a uniform diameter to a tapered diameter (larger at first surface, smaller at second surface), the electrical characteristics are optimized to maintain differential impedance with smaller separation distances, reducing the overall area required
2Reliability
If through-hole interconnections are made thicker to facilitate formation, then manufacturing is easier, but the separation distance must be increased to maintain differential impedance, degrading transmission characteristics
Solution Approach 1:
The through-hole interconnections feature non-uniform diameter distribution: larger diameter at the first surface for easier manufacturing and electrical connection, and smaller diameter at the second surface to reduce capacitive coupling with adjacent through-holes. This local quality variation allows maintaining good transmission characteristics with smaller separation distances
Solution Approach 2:
Instead of varying the through-hole diameter in a single dimension (uniform thickness), the invention introduces dimensional variation along the depth axis of the substrate. The diameter changes from larger at the first surface to smaller at the second surface, creating a tapered structure that optimizes both manufacturability and transmission characteristics
3Quantity of substance
If separation distance between through-hole interconnections is reduced, then high-density mounting is achieved, but differential impedance control becomes difficult with standard uniform through-holes
Solution Approach 1:
By making the through-hole diameter location-dependent (larger at first surface, smaller at second surface), the electrical characteristics of each through-hole are optimized. The smaller diameter portion reduces parasitic capacitance between adjacent through-holes, enabling better differential impedance control even when separation distance is reduced for high-density mounting
Solution Approach 2:
The diameter parameter of through-hole interconnections is varied along the substrate thickness direction. This parameter change allows the separation distance between through-holes to be reduced while maintaining differential impedance within acceptable tolerances, enabling high-density transmission line configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the realization of high-density transmission lines with reduced footprint without degrading transmission characteristics, allowing for closer spacing of through-hole interconnections and improved mounting density.
Implementation Method 1
achieved through sandblasting techniques to form through holes with varying diameters within the substrate
Data Source
AI summary
An interconnection substrate includes: a substrate having a first surface and a second surface opposite the first surface; and a transmission line including two parallel through-hole interconnections that are exposed to the first and second surfaces and are formed inside the substrate. Also, at least one of the two through-hole interconnections includes a narrow portion having a smaller diameter than a diameter of the through-hole interconnection in the first surface and a diameter of the through-hole interconnection in the second surface.