Tapered Via Polymer Adhesion for PCB Metal Film
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Solution Overview
Problem
Current methods for forming copper wiring on insulative substrates in printed wiring boards are inefficient, as they require complex polymerization processes and UV irradiation, which can lead to uneven metal deposition and reduced adhesiveness between the substrate and the metal film.
Innovation Solution
A method involving the preparation of insulative substrates with tapered penetrating holes, where a composition containing a polymerization initiator and polymerizable compound is applied and irradiated to form a polymer, followed by the application of a plating catalyst and electroless plating to deposit a metal film on the inner walls, ensuring uniform energy exposure and enhanced adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to form metal films on insulative substrates, then the process is simple, but the adhesion and conductivity of metal films in tapered holes are insufficient
Solution Approach 1:
A polymer layer is formed on the inner wall of the tapered hole before metal film deposition. This preliminary polymer layer serves as an adhesive promoter and provides a surface that enhances subsequent metal film adhesion and conductivity in the tapered hole structure.
Solution Approach 2:
The polymer acts as an intermediary substance between the insulative substrate and the metal film. It mediates the interface properties, improving adhesion and electrical conductivity by creating a transition layer that bridges the insulative and conductive materials.
2Strength
If tapered holes are formed in insulative substrates, then the structural integrity is maintained, but uniform metal film formation becomes difficult
Solution Approach 1:
The polymer layer is applied specifically to the inner wall surface of the tapered hole, providing localized adhesion promotion where it is most needed. This local treatment ensures uniform metal film formation on the tapered surface while maintaining the overall structural integrity of the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient formation of uniform metal films on insulative substrates with improved adhesiveness, enabling the transmission of high-speed signals and enhancing the strength and conductivity of printed wiring boards.
Implementation Method 1
forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole
Implementation Method 2
applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole
Data Source
AI summary
A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.