Tapering Insulation Barrier for High Voltage Lead-Through Device
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Solution Overview
Problem
The existing high voltage electromagnetic induction devices face issues with uneven electric resistance and stress distribution along the lead-through device due to a smaller cross-sectional area at the barrier end, leading to reduced electric withstand strength.
Innovation Solution
A high voltage electromagnetic induction device design featuring a lead-through device with a tapering internal portion and an electrical insulation barrier that also tapers, increasing the distance between the barrier and the lead-through device surface, creating a controlled electrical field for more even voltage drop and stress distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a barrier is arranged around the lead-through device with a smaller cross-sectional area at the end, then the electric withstand strength is increased, but the electric resistance distribution becomes uneven and maximum stresses increase
Solution Approach 1:
The barrier is designed with varying cross-sectional area along its length, creating different local properties. The larger cross-sectional area at the end portion provides better stress distribution and lower electric resistance in that region, while the overall barrier structure maintains high electric withstand strength. This local variation in geometry optimizes both strength and stress distribution.
Solution Approach 2:
Instead of reducing the barrier cross-sectional area at the end to increase electric withstand strength (conventional approach), the invention inverts this by increasing or maintaining a larger cross-sectional area at the end portion. This reverse approach simultaneously achieves high electric withstand strength while improving stress distribution uniformity and reducing maximum stresses.
2Stress or pressure
If the cross-sectional area between the barrier and lead-through device is reduced, then the electric field strength is increased, but the resistance distribution becomes uneven resulting in higher maximum stresses
Solution Approach 1:
The barrier exhibits local quality variations with different cross-sectional areas at different positions. The end portion has a larger cross-sectional area that provides better resistance distribution, while other portions are optimized for electric field strength. This spatial variation in geometry allows simultaneous optimization of both electric field strength and resistance distribution uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the electric withstand strength by achieving a more even voltage and stress distribution, reducing maximum stresses and improving the overall performance of the device.
Implementation Method 1
an electrical insulation barrier arranged around and distanced from the internal portion
Implementation Method 2
the electrical insulation barrier is tapering relative to the lead-through device such that the distance between the internal surface of the electrical insulation barrier and the external surface of the lead-through device increases in said direction
Data Source
AI summary
A high voltage electromagnetic induction device including: a lead-through device-receiving structure having an opening for receiving a lead-through device, a lead-through device extending through the opening, wherein an internal portion is tapering in a direction along the central axis of the lead-through device away from the opening, and an electrical insulation barrier which is arranged in the lead-through device-receiving structure, arranged around and distanced from the internal portion, and which electrical insulation barrier is tapering in the direction, whereby a duct is formed between the internal surface of the electrical insulation barrier and the external surface of the internal portion of the lead-through device, wherein the electrical insulation barrier is tapering relative to the lead-through device such that the distance between the internal surface of the electrical insulation barrier and the external surface of the lead-through device increases in the direction.