Target Assembly Insulating Plate Sputtering Discharge
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Solution Overview
Problem
In sputtering processes, abnormal discharging occurs between the projected metal backing plate and the insulating target, causing the bonding material to seep out and contaminating the insulator film, and existing solutions complicate the reuse of backing plates by requiring removal and reformation of insulator films.
Innovation Solution
A target assembly with an annular insulating plate that encloses the target's circumference, maintaining a clearance to prevent electron charging and allowing easy detachment for separating the target and backing plate, eliminating the need for insulator film removal and reformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the projected portion of the metal backing plate is used to fix the target assembly, then the target assembly can be securely positioned, but abnormal discharging occurs due to electron charging in the clearance between the target and shield plate
Solution Approach 1:
An insulating plate is introduced as an intermediary component between the metal backing plate's projected portion and the plasma environment. This insulating plate prevents electron charging by blocking the plasma's direct interaction with the conductive metal surface, thereby eliminating abnormal discharging while preserving the mechanical positioning function of the projected portion
2Reliability
If an insulator film is formed on the bonding portion to prevent abnormal discharging, then bonding material seepage is prevented, but the backing plate reuse process becomes complex requiring film removal and reformation
Solution Approach 1:
The insulating plate is designed as a disposable or easily replaceable component rather than a permanent coating. When the target is replaced, the insulating plate can be simply removed and discarded, eliminating the complex processes of film removal and reformation while maintaining the function of preventing bonding material seepage during operation
3Object-affected harmful factors
If the insulating plate is made thicker to prevent electron charging, then abnormal discharging is reduced, but the clearance between the insulating plate and shield plate decreases
Solution Approach 1:
The insulating plate is designed with non-uniform thickness, featuring a thicker portion at the projected portion area where electron charging occurs, and a thinner portion in other areas. This local quality variation provides sufficient insulation where needed while maintaining adequate clearance between the insulating plate and the shield plate in other regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents abnormal discharging and ensures the bonding material does not seep out, facilitating easy reuse of the backing plate by maintaining a stable film formation process without the need for repeated insulator film removal and reformation.
Implementation Method 1
the electrons in the plasma will sometimes be electrostatically charged, through the above-mentioned clearance, in the projected portion that is made of metal
Implementation Method 2
abnormal discharging occurs due to the potential difference between the side surface of the target and the projected portion
Implementation Method 3
a backing plate bonded to one surface of the target via a bonding material
Implementation Method 4
Sputtering apparatus is used in order to form insulator films with good productivity
Data Source
AI summary
A target assembly is provided in which an abnormal discharging between a projected portion of a backing plate and a side surface of the target is prevented and also in which a bonding material to bond the target and the backing plate can be surely prevented from seeping to the outside and also which is easy in reusing the backing plate. The target assembly according to this invention having: a target made of an insulating material; and a backing plate bonded to one surface of the target via a bonding material, the backing plate having a projected portion which is projected outward beyond an outer peripheral edge of the target, further has an annular insulating plate. The annular insulating plate: encloses a circumference of the target while maintaining a predetermined clearance to a side surface of the target; and covers that surface of the projected portion.