Targeted Thermal Spreader Composition for Insulated Electronics Cooling
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Solution Overview
Problem
Conventional computing systems face challenges in heat dissipation due to power and space limitations, leading to performance degradation and potential failure of electronic components.
Innovation Solution
The use of thermally conductive compositions that are malleable and electrically insulating, allowing targeted heat dissipation from electronic components by being positioned on an electrically insulating material to maintain thermal communication with specific areas of heat generation while preventing electrical conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management solutions are used, then heat dissipation capacity is limited, but power consumption and space requirements increase
Solution Approach 1:
The patent changes the thermal conductivity parameter of the encapsulant material by incorporating thermally conductive particles (such as aluminum oxide, boron nitride, or diamond particles) into the encapsulant matrix. This composite approach increases thermal conductivity from typical values of 0.2-0.5 W/mK to 1-10 W/mK or higher, enabling effective heat dissipation without increasing power consumption or requiring additional active cooling components.
Solution Approach 2:
The patent employs composite encapsulant materials consisting of a base encapsulant (such as epoxy, silicone, or polymer) combined with thermally conductive particles or fillers. This composite structure leverages the electrical insulation properties of the base material while the embedded conductive particles create thermal pathways for heat dissipation, resolving the contradiction between thermal management effectiveness and power/space constraints.
2Temperature
If conventional thermal management solutions are used, then heat dissipation is insufficient, but device space is consumed
Solution Approach 1:
The patent merges the thermal management function with the existing encapsulant structure that already protects the semiconductor device. By incorporating thermally conductive particles into the encapsulant material itself, the solution combines electrical insulation, mechanical protection, and enhanced heat dissipation into a single integrated component, eliminating the need for separate thermal management devices and saving device space.
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the encapsulant material through particle reinforcement, transforming it from a passive insulating material into an active thermal management medium. This parameter change enables the encapsulant to dissipate heat effectively within the existing device footprint without requiring additional space for separate cooling components.
3Temperature
If thermally conductive material is applied to electronic component, then heat dissipation improves, but electrical insulation is compromised
Solution Approach 1:
The patent uses composite encapsulant materials where thermally conductive particles (such as aluminum oxide, boron nitride, or diamond) are dispersed within an electrically insulating matrix (such as epoxy, silicone, or polymer). The insulating matrix continuous phase maintains electrical isolation while the conductive particles form thermal pathways, simultaneously achieving heat dissipation and electrical insulation.
Solution Approach 2:
The patent applies local quality by creating regions of high thermal conductivity within the encapsulant material through particle concentration and distribution control. The thermally conductive particles are strategically positioned and distributed to create efficient heat transfer pathways from the semiconductor device to the encapsulant exterior, while the surrounding insulating matrix maintains electrical isolation. This local optimization of thermal properties within the composite structure enables targeted heat dissipation without compromising overall electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from electronic components, enhancing their performance and longevity by ensuring targeted thermal management without electrical interference.
Implementation Method 1
a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component
Data Source
AI summary
Thermal spreaders for targeted heat dissipation of an electronic component are disclosed. One thermal spreader includes a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component of a computing device while electrically insulating the electronic component. The thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component. Apparatus and systems including one or more of the thermal spreaders for targeted heat dissipation of one or more electronic components included therein are also disclosed.