Targeted X-Ray Inspection for Electronic Components
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Solution Overview
Problem
The existing methods for testing electronic components for defects using combined automatic optical inspection (AOI) and non-destructive material testing (NDT) with X-radiation are time-consuming and costly, especially when the NDT device is separate from the production line, as they require examining the entire component with X-radiation, leading to increased production line downtime and costs.
Innovation Solution
A method where the coordinates of regions of interest (ROIs) undetectable by AOI are determined during AOI and transmitted to a computer, allowing only these ROIs to be examined by X-ray NDT, using an identifier like a barcode for accurate alignment and potentially using an open microfocus X-ray tube for enhanced defect detection, thereby reducing testing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire electronic component is examined by X-ray NDT, then hidden defects are detected, but testing time and costs increase significantly
Solution Approach 1:
The examination area is segmented into regions of interest (ROIs) based on AOI results. Only these specific regions are examined by X-ray NDT instead of the entire component, reducing testing time while maintaining defect detection capability for critical areas.
Solution Approach 2:
Different examination methods are applied to different regions: AOI for visible areas and X-ray NDT only for hidden defect-prone regions identified by AOI. This localized approach optimizes the balance between detection reliability and testing efficiency.
2Ease of manufacture
If a separate X-ray NDT device is used, then costs per production line are reduced, but testing time increases due to component transport and re-examination
Solution Approach 1:
AOI examination is performed first to identify potential defect regions before X-ray NDT. This preliminary action allows the X-ray device to focus only on critical areas, significantly reducing examination time when using a separate device.
Solution Approach 2:
The AOI system acts as an intermediary that guides the X-ray examination process. By providing ROI coordinates to the X-ray device, AOI enables targeted examination that reduces time loss associated with separate device testing.
3Productivity
If integrated X-ray NDT test device is used in production line, then testing is streamlined, but production line stops during maintenance and each line needs its own device
Solution Approach 1:
A single X-ray NDT device is designed to serve multiple production lines by accepting ROI data from different AOI systems. This universal device reduces overall system complexity and eliminates the need for dedicated X-ray devices for each production line.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and costs associated with X-ray NDT by focusing only on ROIs, ensuring accurate defect detection and process control, leading to lower reject rates and production costs while improving fault detectability down to 0.1 μm.
Implementation Method 1
non-destructive material testing (NDT) by means of X-radiation
Data Source
AI summary
The invention relates to a method for testing an electronic component for defects, by examining the electronic component in a production line by means of automatic optical inspection; determining the coordinates of regions in which an examination using automatic optical inspection is not possible; transmitting the coordinates of these regions from the production line to a computer; transporting the electronic component from the production line into an X-ray device which is arranged outside the production line, for non-destructive material testing; transmitting the coordinates of the regions from the computer to this X-ray device; examining the electronic component by means of the X-ray device only in the regions in which an examination using automatic optical inspection is not possible; transmitting the results of the examination in the X-ray device to the computer; returning the electronic component to the production line if the result indicates that it is not defective.