TCB Substrate Transfer Arm and Pedestal for Dual-Row Handling
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Solution Overview
Problem
Thermal compress bonding (TCB) in integrated circuit manufacturing faces a slower run rate compared to other techniques, primarily due to limitations in bonding time, substrate transfer arm (STA) movement time, and pre-heat time, especially when handling single-die products, which leads to increased material handling time and reduced utilization of TCB bonders.
Innovation Solution
The introduction of enhanced Pedestal and STA designs that allow for the simultaneous pick and place of two rows on the same bond stage, along with optimized vacuum control systems and software algorithms, enables faster substrate handling and reduced STA movement time, thereby increasing the TCB run rate without modifying pre-heat times or quality requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If single-die bonding is performed on substrate package, then bonding quality is maintained, but material handling time increases and run rate decreases
Solution Approach 1:
The substrate package is divided into multiple bonding regions (first bonding region and second bonding region) that can be processed simultaneously. The STA is segmented into multiple suction cup arrays that can independently handle different substrate rows, allowing parallel processing of multiple bonding operations without compromising quality.
Solution Approach 2:
The system performs preliminary positioning and preparation of multiple substrate rows on the bond stage before actual bonding begins. The enhanced STA design allows substrates to be pre-positioned in multiple rows simultaneously, reducing the sequential handling time while maintaining bonding quality through controlled vacuum application and precise positioning.
2Productivity
If STA movement time is reduced to increase run rate, then productivity improves, but substrate handling precision may be compromised
Solution Approach 1:
The STA system uses dynamic vacuum control where vacuum pressure is adjusted based on the operational phase (loading, bonding, unloading). The system transitions between different vacuum states to optimize both speed and precision, allowing rapid substrate exchange while maintaining precise positioning through controlled vacuum application and release timing.
Solution Approach 2:
The enhanced STA design enables continuous substrate handling operations by maintaining vacuum grip throughout the movement cycle. Multiple suction cup arrays operate in continuous cycles of picking, transporting, and placing substrates without complete release cycles, eliminating idle time while preserving positioning accuracy through sustained vacuum control.
3Reliability
If pre-heat time is extended to improve bonding quality, then bonding reliability increases, but cycle time increases and productivity decreases
Solution Approach 1:
Substrates undergo pre-heating in advance while positioned on the bond stage before the actual bonding process begins. This preliminary thermal preparation ensures that substrates reach optimal temperature for bonding without extending the critical bonding cycle time, as the heating occurs during substrate positioning and preparation phases.
Solution Approach 2:
The pre-heating process operates continuously during substrate handling and positioning operations. Multiple substrates are heated simultaneously in parallel, eliminating sequential heating delays and maintaining continuous productive action throughout the process cycle while ensuring all substrates achieve required thermal conditions for reliable bonding.
4Loss of time
If multiple rows are processed simultaneously on bond stage, then material handling time decreases, but device complexity increases
Solution Approach 1:
The bond stage is segmented into multiple independent bonding regions with dedicated vacuum control zones. The STA is divided into multiple suction cup arrays that can independently address different substrate rows. This segmentation enables parallel processing of multiple rows simultaneously while maintaining manageable system complexity through modular, independently controllable zones.
Solution Approach 2:
The enhanced STA design incorporates universal suction cup arrays that can handle multiple substrate rows with a single device configuration. The same STA structure performs multiple functions (picking, transporting, placing multiple rows) without requiring separate dedicated mechanisms for each row, reducing overall system complexity while achieving parallel processing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces material handling time and overall cycle time, leading to cost savings and increased productivity, potentially saving millions of dollars by maximizing bonding time and eliminating STA movement time limitations, thus enhancing the operational efficiency of TCB processes.
Implementation Method 1
picking up, using suction cups of a substrate transfer arm (STA), a first substrate row from a first row of a tray
Implementation Method 2
thermal compression bonding of integrated circuits
Data Source
AI summary
This disclosure describes enhanced substrate transfer arm (STA) and pedestal designs related to a thermal compression bonding process. The designs include multiple row patterns of the STA and the pedestal used to: pick up a first substrate row from a first row of a tray; place the first substrate row onto a first row of a bond stage corresponding to the first row of the tray; pick up a second substrate row from the tray; place, using the suction cups, the second substrate row onto a remaining empty row of the bond stage; pick up the first substrate row after thermal bonding from the bond stage; place the first substrate row after thermal bonding onto the tray; when all substrates from the tray have been thermally bonded, pick up a last substrate row after thermal bonding from the bond stage; and place the last substrate row onto the tray.