Thermocompression Bonding Stopper for Die Stack Compression Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor manufacturing processes face challenges in controlling the compression of die stacks, leading to issues like solder depletion, non-conductive film leakage, and electrical shorting due to over-pressing, which reduces manufacturing yield and reliability.
Innovation Solution
The implementation of a stopper structure within the semiconductor manufacturing system, which includes a cavity to limit the compression of die stacks during thermocompression bonding, preventing excess solder or bonding material from being squeezed out and maintaining uniform gaps between dies, thereby enhancing the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If compression force is increased to improve bonding strength, then bonding strength is improved, but solder depletion and electrical shorting occur
Solution Approach 1:
A stopper structure is introduced as an intermediary component between the compression force and the die stack. The stopper limits the maximum compression distance, preventing excessive force from being applied to the solder joints. This mediator allows sufficient compression for bonding while preventing over-compression that causes solder depletion and electrical shorting between adjacent dies.
2Manufacturing precision
If compression is increased to ensure complete bonding, then bonding completeness is improved, but non-conductive film leakage occurs
Solution Approach 1:
The stopper acts as a physical barrier that limits compression displacement. By controlling the maximum compression distance, it ensures that the non-conductive film remains contained within the bonding interface without being forced to leak outward, while still allowing sufficient compression for complete bonding of the die stack.
3Productivity
If compression force is increased to reduce manufacturing time, then throughput is improved, but manufacturing defects increase
Solution Approach 1:
The stopper enables high-speed compression by providing immediate mechanical feedback when the compression limit is reached. This prevents the need for complex real-time monitoring systems while ensuring consistent compression limits are maintained, thereby supporting high throughput without increasing defect rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces manufacturing defects, increases the reliability of die stacking, and enhances the throughput of semiconductor devices by ensuring controlled compression and maintaining the integrity of bonding material and non-conductive film, resulting in improved yield and faster manufacturing times.
Implementation Method 1
limit the compression of die stacks during thermocompression bonding
Data Source
AI summary
A thermocompression bonding (TCB) apparatus can include a wall having a height measured in a first direction and configured to be positioned between a first pressing surface and a second pressing surface of a semiconductor bonding apparatus. The apparatus can include a cavity at least partially surrounded by the wall, the cavity sized to receive a semiconductor substrate and a stack of semiconductor dies positioned between the semiconductor substrate and the first pressing surface, the stack of semiconductor dies and semiconductor substrate having a combined unpressed stack height as measured in the first direction. In some embodiments, the unpressed stack height is greater than the height of the wall, and the wall is configured to be contacted by the first pressing surface to limit movement of the first pressing surface toward the second pressing surface during a semiconductor bonding process.