Transmission Control Module Encapsulation with Contact Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated transmission control modules with bare semiconductor components are sensitive to contamination and short circuits due to space restrictions, leading to complex and costly production and packaging requirements, resulting in expensive transmission control modules.
Innovation Solution
A module arrangement with a substrate plate featuring an electronic circuit and unhoused semiconductor components contacted by exposed bonding wires, encapsulated with a protective compound, including a contact frame that surrounds the circuit to prevent contamination and moisture, allowing for cost-effective protection and simplified production without complex housings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetically sealed housing is used to protect electronic circuits, then protection against contamination and moisture is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent uses a protective compound (encapsulant) that forms a thin film layer over the electronic circuit components, providing protection against moisture and contamination without requiring a complex hermetically sealed housing. This encapsulation approach simplifies the overall device structure while maintaining reliability.
Solution Approach 2:
The protective compound serves as a cost-effective alternative to expensive hermetic housings. While the encapsulant may have limited lifespan compared to metal housings, it provides sufficient protection for the intended application at a fraction of the cost and complexity of traditional hermetic sealing solutions.
2Reliability
If hermetically sealed housing is used to protect electronic circuits, then protection against contamination is improved, but manufacturing cost increases
Solution Approach 1:
The protective compound is applied as a thin film encapsulant that can be deposited using standard PCB manufacturing techniques, significantly reducing manufacturing costs compared to hermetically sealed housings which require precision machining, welding, or brazing operations.
Solution Approach 2:
The encapsulant material provides economical protection at a fraction of the cost of metal housings. The material can be applied in a single coating process and cured, eliminating the need for expensive assembly operations required for hermetic sealing.
3Reliability
If complex housing is used to protect module arrangements, then protection against environmental factors is improved, but ease of manufacture deteriorates
Solution Approach 1:
The protective compound forms a conformal thin film that adheres to the circuit board surface and encapsulates components, providing environmental protection without requiring complex housing structures. This approach integrates protection directly into the PCB manufacturing process.
Solution Approach 2:
The protective function is merged with the PCB manufacturing process itself. The encapsulant is applied and cured as part of the board fabrication, combining structural support, electrical insulation, and environmental protection functions into a single integrated process step.
4Volume of moving object
If exposed bonding wires are used in semiconductor components, then space restrictions are addressed, but sensitivity to contamination and short circuits increases
Solution Approach 1:
The protective compound forms a thin film encapsulation that covers the exposed bonding wires and semiconductor components, providing a physical barrier against contamination and moisture while maintaining the space-efficient bare-die configuration without requiring additional housing space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides comprehensive, reliable, and cost-effective protection for the electronic components, enabling centralized production and reduced transportation costs, while ensuring reliable electrical contact and extended service life of the transmission control module.
Implementation Method 1
the electronic circuit is completely encapsulated with a protective compound, in particular to protect the bonding wires of the semiconductor component
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A
AI summary
A module assembly (10) for a transmission control module (50) and a transmission control module (50) are proposed. The module assembly (10) has a substrate plate (12) with an electronic circuit (14) which is arranged on a mounting side (13) of the substrate plate (12) and has at least one unhoused semiconductor component (16) which is in contact with exposed bonding wires. The module assembly (10) is defined, in particular, by the fact that it also has a contact frame (18) which runs around the electronic circuit (14) on the mounting side (13) of the substrate plate (12) in an annular fashion, and in that the electronic circuit (14) is completely cast with a protective material (20), in particular for protecting the bonding wires of the semiconductor component (16). As result, costly transportation packaging for the module assembly (10), for example for transportation into an assembly works of the transmission control module (50) can be advantageously dispensed with.