Thermally Conductive Material for Memory Subsystem Heat Dissipation
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Solution Overview
Problem
Existing memory sub-systems face challenges in efficiently managing data throughput and heat dissipation, particularly when the internal temperature of memory devices or controllers exceeds 85 degrees Celsius, leading to throttling and reduced performance due to physical space constraints on PCBs.
Innovation Solution
The implementation of a thermally conductive material (TCM) that is thermally coupled to memory components, acting as a heat sink to dissipate heat without violating height or space restrictions on PCBs, thereby maintaining optimal system performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive material (TCM) is added to dissipate heat from memory components, then heat dissipation capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the TCM application process with the existing memory module manufacturing process. The TCM is applied to memory components during assembly, combining thermal management functionality with the base memory module structure without requiring separate manufacturing steps, thereby improving heat dissipation while minimizing increases in device complexity
Solution Approach 2:
The TCM serves as an intermediary material between the memory components and the ambient environment or heat sink. This intermediary facilitates heat transfer from the memory components (which generate heat during operation) to the surrounding environment, improving thermal management while maintaining a simple overall device architecture
2Productivity
If data throughput is increased, then productivity is improved, but temperature rises leading to throttling and reduced reliability
Solution Approach 1:
The patent implements a feedback mechanism where the system monitors temperature conditions and adjusts data throughput accordingly. When temperature thresholds are approached, the system reduces throughput to prevent thermal damage, ensuring reliable operation. The TCM enhances this feedback loop by more effectively managing heat, allowing higher sustained throughput levels without triggering throttling
Solution Approach 2:
The patent changes the thermal parameters of the memory system by introducing TCM with specific thermal conductivity properties. This parameter change allows the system to maintain lower operating temperatures at high throughput levels, extending the range of reliable operation before throttling becomes necessary
3Temperature
If TCM is applied to fully encapsulate memory components, then heat dissipation is improved, but manufacturing precision requirements increase due to height constraints
Solution Approach 1:
The patent applies TCM with varying degrees of encapsulation based on local requirements. Rather than uniformly encapsulating all components to the same height, the TCM application is tailored to each component's thermal management needs and height constraints, optimizing heat dissipation while accommodating manufacturing tolerances and PCB space restrictions
Solution Approach 2:
The patent employs dynamic TCM materials that can change their physical properties during application or operation. This allows the TCM to adapt to varying height constraints and component geometries, achieving effective thermal management without requiring extremely precise manufacturing tolerances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains the operating temperature of memory systems at a lower level, prolonging the time before throttling occurs, and improving overall efficiency and thermal energy storage without consuming excessive physical resources.
Implementation Method 1
a TCM that is thermally coupled to memory components, acting as a heat sink to dissipate heat
Implementation Method 2
acting as a heat sink to dissipate heat without violating height or space restrictions on PCBs
Data Source
AI summary
Aspects of the present disclosure configure a memory sub-system processor to use a thermally conductive material (TCM) to improve thermal energy storage and heat dissipation to improve a data transfer rate. The TCM surrounds the set of memory components and the processing device and is configured to dissipate heat from the processing device and the set of memory components.