Transparent Conductive Oxide Transfer via Thermal Release
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Solution Overview
Problem
Semiconductor processing techniques, such as heat and particle bombardment, often damage sensitive materials like organic materials, leading to degraded properties in target layers during the fabrication of photovoltaic devices.
Innovation Solution
A transfer process involving a weak adhesion layer and thermal release tape is used to transfer materials onto a target substrate, avoiding exposure to harsh formation processes, allowing for the assembly of photovoltaic devices with sensitive materials without significant heating or extreme deposition environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional semiconductor processing techniques (heat and particle bombardment) are used to form layers, then device fabrication can proceed, but sensitive organic materials are damaged and degraded
Solution Approach 1:
The fabrication process is divided into two separate segments: (1) forming the adhesion layer and transparent conductor layer on a first substrate using conventional processing, and (2) transferring these layers to the target substrate containing sensitive organic materials. This segmentation allows harsh processing to be isolated from sensitive materials.
Solution Approach 2:
The adhesion layer and transparent conductor layer are formed in advance on a sacrificial substrate before the sensitive organic materials are introduced. This preliminary action allows the layers to be pre-formed using conventional techniques without exposing the sensitive materials to damaging conditions.
2Reliability
If solution processed transparent conductive oxides are used, then conductivity can be achieved, but high temperature annealing is required which limits material alternatives
Solution Approach 1:
The patent changes the temperature parameter by performing the annealing process on the first substrate before transfer, rather than after transferring to the target substrate. This allows high-temperature processing without exposing temperature-sensitive organic materials, thereby expanding material compatibility.
3Ease of manufacture
If thermal release tape is applied and mechanically pulled to transfer layers, then the substrate can be removed at the weakest interface, but the process must be carefully controlled to avoid damage
Solution Approach 1:
Thermal release tape is introduced as an intermediary tool to facilitate substrate removal. The tape is applied to the transparent conductor layer, and when mechanically pulled, it selectively removes the substrate at the weakest interface (adhesion layer-substrate interface) while leaving the adhesion layer and transparent conductor layer intact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method minimizes damage to target layers, enabling the use of a wider range of materials and preventing chemical interactions, thus facilitating the fabrication of complex photovoltaic devices with improved interface properties.
Implementation Method 1
applying thermal release tape to the material layer
Data Source
AI summary
A method for fabricating a photovoltaic device includes forming an adhesion layer on a substrate, forming a material layer on the adhesion layer and applying release tape to the material layer. The substrate is removed at a weakest interface between the adhesion layer and the substrate by mechanically pulling the release tape to form a transfer substrate including the adhesion layer, the material layer and the release tape. The transfer substrate is transferred to a target substrate to contact the adhesion layer to the target substrate. The transfer substrate includes a material sensitive to formation processes of the transfer substrate such that exposure to the formation processes of the transfer substrate is avoided by the target substrate.