TCP Semiconductor Device Lead Configuration for Probe Testing
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Solution Overview
Problem
The increasing number of terminals in semiconductor chips leads to a rise in manufacturing costs due to the need for larger pad placement regions and contact pads, and there is a risk of short failures during testing due to the proximity of probe contacts.
Innovation Solution
The TCP-type semiconductor device uses the second terminal portion of each lead for contact with the probe card instead of dedicated contact pads, and the leads are arranged in a configuration with varying second end positions to ensure electrical isolation and prevent short failures, allowing for a reduced pad placement region and lower manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dedicated contact pads are provided for testing, then testing reliability is improved, but manufacturing cost increases and pad placement region area increases
Solution Approach 1:
The patent merges the function of contact pads with the lead structure itself. The second terminal portion of each lead serves dual purposes: electrical connection to the semiconductor chip and contact point for probe card during testing. This eliminates the need for separate dedicated contact pads, thereby reducing manufacturing cost and pad placement region area while maintaining testing reliability.
Solution Approach 2:
The lead structure is designed to perform multiple functions: it provides electrical connection between the chip and external circuits, and simultaneously serves as a contact point for testing operations. The second terminal portion of each lead acts as both a functional electrical terminal and a test contact point, reducing the overall complexity and cost of the device.
2Productivity
If probe pitch is narrowed to follow test terminal pitch, then testing capability is improved, but electrical isolation between adjacent probes becomes difficult to ensure
Solution Approach 1:
The patent distributes probe contact points across multiple rows in the width direction of the base film. By arranging the second terminal portions of leads in a multi-row configuration rather than a single linear row, the probe pitch can be effectively reduced without compromising electrical isolation. This dimensional distribution allows adjacent probes to be closer while maintaining sufficient spacing through the row distribution pattern.
3Ease of manufacture
If pad placement region is reduced to lower manufacturing cost, then manufacturing cost is improved, but contact space for probes becomes insufficient
Solution Approach 1:
The patent segments the lead structure into distinct portions, with the second terminal portion specifically designated for probe contact. This segmentation allows the contact function to be integrated into the lead structure itself, enabling reduced pad placement region while ensuring sufficient contact space is allocated to the terminal portions where probes make contact.
Data Source
AI summary
A semiconductor device includes a base film, a semiconductor chip mounted on the base film, and a plurality of leads formed on the base film, each of the leads including one end coupled to the semiconductor chip and another end being opposite to the one end. The another end of a first one of the leads and the another end of a second one of the leads are located at different positions respectively between the semiconductor chip and a cut line along which the base film is cut.