TDI Sensor Split Readout for Dual-Channel Wafer Inspection
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Solution Overview
Problem
Current semiconductor wafer inspection systems face challenges in efficiently collecting multiple channels of image data simultaneously, leading to increased inspection time and expense due to the need for multiple inspections and measurements across various imaging modes.
Innovation Solution
A sensor system configured with dual sensing regions and readout circuitry capable of receiving and processing two channels of image data simultaneously, utilizing a novel arrangement of lenses, reflective surfaces, and relays to enable high-speed scanning in multiple imaging modes such as brightfield and darkfield imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple inspections are conducted to collect more than one channel of information, then the detection capability for various defect types is improved, but the total inspection time increases
Solution Approach 1:
The patent combines multiple imaging modes (dark field and bright field) into a single inspection pass by using a TDI sensor that can simultaneously capture data from multiple channels. The sensor integrates multiple sensing regions and readout circuits to collect diverse defect information without requiring separate inspections, thereby maintaining high detection capability while reducing total inspection time.
Solution Approach 2:
The TDI sensor is designed with multi-functionality to perform multiple imaging modes simultaneously. By incorporating multiple sensing regions that can operate in different imaging configurations (dark field, bright field, and intermediate modes), the sensor provides universal detection capability for various defect types in a single inspection operation, eliminating the need for multiple specialized inspections.
2Reliability
If multiple inspections are performed to collect comprehensive image data, then the reliability of defect detection is improved, but the inspection expense increases
Solution Approach 1:
The patent merges multiple inspection functions into a single integrated system. By using a TDI sensor with multiple sensing regions and readout circuits that can simultaneously capture dark field, bright field, and intermediate imaging modes, the system achieves reliable defect detection across various defect types without requiring multiple separate inspection devices or repeated inspections, thereby reducing overall inspection expense.
3Device complexity
If traditional sensors are used to inspect multiple imaging modes, then the system is simpler to implement, but the inspection speed decreases
Solution Approach 1:
The patent replaces traditional mechanical or sequential inspection methods with a solid-state TDI sensor that can simultaneously process multiple imaging modes at high speed. The TDI technology uses time-delay integration and electronic readout circuits to capture and process multiple channels of image data in parallel during a single scan, eliminating the need for multiple sequential inspections and significantly increasing inspection throughput while maintaining implementation feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for simultaneous dual-channel inspection, reducing inspection time and cost by enabling robust and reliable image collection across multiple imaging modes, thereby improving inspection efficiency and throughput.
Implementation Method 1
a sensor configured to receive light energy for purposes of inspecting a specimen
Data Source
AI summary
A method and apparatus for simultaneous high-speed inspection and acquisition of multiple data channels is provided. The method and apparatus enables inspecting semiconductor wafers and reticles and comprises converting a single image region into two image sections, reorienting one image into a transposed configuration enabling simultaneous scanning of two inspected object locations with a single sensor, and controlling acquisition parameters for a second image by using information collected from a first image in a feedback arrangement. The design provides a dual-linear or time-delay-integration sensor operating in a split readout configuration mode to simultaneously provide data from two regions of the sensor using two sets of readout circuitry.