Two-Dimensionally Distributed Waveplates for Photonic Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The alignment of photonic integrated circuits (PIC) with printed optical boards (POBs) is challenging due to the lack of optical Input/Output standards, leading to difficulties in determining and maintaining proper alignment, which results in light loss and increased manufacturing costs.
Innovation Solution
A system utilizing two-dimensionally distributed waveplates (TDWs) composed of p-doped and n-doped silicon layers, which can change the dielectric constant at specific locations to redirect light from a printed optical board to a photonic integrated circuit, ensuring accurate alignment through electrical control and feedback mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional alignment methods are used for PIC with POB, then manufacturing process is simple, but alignment precision is insufficient leading to light loss
Solution Approach 1:
The patent introduces an intermediary alignment mark structure that includes a first alignment mark on the POB and a second alignment mark on the PIC package. This intermediary alignment mark system mediates the alignment process between the POB and PIC, enabling precise alignment without requiring complex direct alignment mechanisms. The alignment marks serve as intermediate reference points that simplify the alignment operation while achieving high precision.
Solution Approach 2:
The patent replaces mechanical alignment adjustment mechanisms with an optical alignment approach using alignment marks and light transmission. Instead of relying on mechanical positioning systems that require complex adjustments, the solution uses optical fields and alignment marks that can be visually detected and adjusted, substituting mechanical complexity with optical precision.
2Manufacturing precision
If alignment marks are added to improve alignment, then alignment precision improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the alignment mark structure with the existing POB and PIC package manufacturing processes. The first alignment mark is integrated into the POB structure, and the second alignment mark is integrated into the PIC package structure. By combining the alignment functionality with existing structural elements rather than adding separate components, the manufacturing process remains relatively simple while achieving improved alignment precision.
3Area of moving object
If optical connectors are crowded near SoC, then integration density improves, but alignment difficulty increases
Solution Approach 1:
The patent segments the alignment function into separate alignment marks that can be independently positioned and adjusted. By dividing the alignment system into discrete alignment mark elements on the POB and PIC package, the system can handle crowded connector arrangements more effectively. Each alignment mark can be precisely positioned independently, allowing for accurate alignment even when optical connectors are densely packed near the SoC.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively redirects light between the POB and PIC, ensuring maximum channel performance and bidirectional signal flow, even after assembly, by fine-tuning the light beam's location and shape, thus addressing the alignment issues and increasing product reliability.
Implementation Method 1
the one or more TDWs configured to be driven to change a dielectric constant at a two-dimensional location on the one or more TDWs such that the light received at the one or more TDWs is redirected at the two-dimensional location
Implementation Method 2
one or more two-dimensionally distributed waveplates (TDWs) configured to redirect light between the POB and the PIC package
Data Source
AI summary
Example implementations described herein are directed to an interface configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide, and a photonic integrated circuit (PIC), the interface involving two-dimensionally distributed waveplates (TDWs) having multiple layers of p-doped and n-doped silicon, the TDWs configured to be driven to change a dielectric constant at a two dimensional location on the TDWs such that the received light is redirected at the two dimensional location.