Teardrop Conductive Pattern for Fan-Out Package Stress Relief

The patent applies local quality by designing a teardrop-shaped conductive pattern with varying width along its length. The wider end provides enhanced mechanical support and stress distribution where the conductive pattern connects to the conductive pillar, while the narrower end facilitates better electrical connection. This non-uniform local geometry optimizes both mechanical reliability and electrical performance in the constrained space of compact packages.

The patent implements beforehand cushioning by incorporating a protection layer that extends over the conductive pattern and fills the trench structure. This protection layer is formed prior to subsequent packaging processes, providing advance mechanical support and stress relief to the conductive elements. The extended protection layer acts as a cushion against thermal expansion stresses and mechanical deformation that would otherwise compromise the reliability of the redistribution circuit in compact packages.

The teardrop-shaped conductive pattern uses local quality variations to maintain connectivity integrity. The wider portion of the teardrop shape provides increased cross-sectional area for current flow and mechanical strength at critical connection points, while the tapered sections optimize space utilization. This local geometric optimization allows reliable conductive paths even when components are densely packed in smaller areas.

The patent employs composite material structures by combining the conductive pattern material with the extended protection layer material in a layered composite structure. This composite approach provides both electrical conductivity and mechanical protection, ensuring that conductive elements maintain their integrity and connectivity even under the stress of high integration density packaging.