Thermoelectric Cooler Alignment for Photonic Integrated Circuit Thermal Management
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Solution Overview
Problem
Photonic integrated circuits (PICs) face challenges in thermal management due to heat generated by laser arrays, which affects signal integrity and increases power consumption, particularly with the use of thermoelectric coolers (TECs) that consume substantial power.
Innovation Solution
The use of a TEC with a cross-sectional area less than that of the carrier, strategically aligned with heat-generating components, along with a support post of higher thermal resistivity, to optimize thermal management and reduce power consumption by focusing cooling efforts on active components while minimizing unnecessary cooling of passive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a TEC with cross-sectional area equal to the carrier is used for thermal management, then heat removal capability is improved, but power consumption increases substantially
Solution Approach 1:
The TEC is positioned to align specifically with the heat-generating component (laser array) rather than covering the entire carrier surface. This localized cooling approach removes heat effectively from the critical area while minimizing the TEC's active area, thereby reducing power consumption compared to full-carrier cooling
2Use of energy by moving object
If the TEC cross-sectional area is reduced to lower power consumption, then power consumption is improved, but heat removal efficiency may deteriorate
Solution Approach 1:
The TEC's cross-sectional area is optimized to match the footprint of the heat-generating component, providing sufficient cooling capacity exactly where needed. This targeted approach maintains effective heat removal from the laser array while using minimal TEC area, thus achieving low power consumption without sacrificing heat removal efficiency
3Temperature
If uniform cooling across the entire carrier is applied, then thermal management coverage is improved, but signal integrity may deteriorate due to excessive cooling of passive components
Solution Approach 1:
The TEC is positioned to cool only the active heat-generating component (laser array) and not the passive components on the carrier. This selective cooling maintains signal integrity by avoiding excessive cooling of passive components while still providing adequate thermal management coverage for the critical active component
4Temperature
If the TEC is aligned with heat-generating components, then thermal management efficiency is improved, but device complexity increases
Solution Approach 1:
The TEC is configured with its cross-sectional area and position to match the heat-generating component's footprint, creating a straightforward geometric alignment. This approach improves thermal management efficiency by concentrating cooling where needed while maintaining relatively simple device structure, as the alignment follows the natural geometric correspondence between the TEC and the component it cools
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal management efficiency, reducing power consumption and maintaining signal integrity by ensuring effective heat removal from active components without excessive cooling of passive components.
Implementation Method 1
One approach to thermal management has been to use thermoelectric coolers (TEC) to remove heat from the PICs
Implementation Method 2
a support post coupled to the surface of the carrier, wherein the support post has a higher thermal resistivity than the TEC
Data Source
AI summary
An apparatus comprising a carrier comprising at least one heat-generating component and a thermoelectric cooler (TEC) coupled to a surface of the carrier, wherein the cross-sectional area of the TEC is less than the cross-sectional area of the carrier, and wherein the TEC is aligned with the heat-generating component. Included is an apparatus comprising a carrier comprising a plurality of optical transmitters and an active component, at least one TEC coupled to the surface of the carrier, and a support post coupled to the surface of the carrier, wherein the support post has a higher thermal resistivity than the TEC, wherein the cross-sectional area of the TEC is less than the cross-sectional area of the carrier, and wherein the TEC is aligned with the optical transmitters, the active component, or both.