Integrated TEC Array Sensing for Precise Reticle Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for cooling reticles in semiconductor processing are inefficient due to the need for separate temperature measurements, which disrupt the cooling process and result in inaccurate temperature control due to unknown air gaps between the reticle and the thermoelectric chip array.
Innovation Solution
Integration of infrared (IR) radiation sensors and flux sensors with the thermoelectric chip array allows for in-situ temperature measurements and air gap height determination, enabling precise and efficient reticle cooling by adjusting the cooling process based on real-time temperature data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature measurements are performed by separating the reticle from the TEC array and using external IR sensors, then temperature measurement can be performed, but the cooling process is disrupted and time is lost
Solution Approach 1:
The patent integrates IR sensors directly into the TEC array structure, merging the temperature measurement function with the cooling function. This allows simultaneous temperature monitoring and cooling operation without separating the reticle or interrupting the cooling process, thereby resolving the contradiction between measurement capability and process continuity.
Solution Approach 2:
The integrated IR sensors enable continuous temperature measurement during the cooling process, allowing the cooling operation to proceed without interruption. The measurement and cooling actions occur simultaneously and continuously, eliminating the time loss associated with separate measurement steps.
2Ease of operation
If the air gap height between the TEC array and reticle is not known or not maintained, then the system is simpler to operate, but heat conduction cannot be accurately determined and target temperature cannot be achieved
Solution Approach 1:
The patent incorporates feedback mechanisms where IR sensors continuously measure the reticle temperature and provide this information to a control system. The control system uses this feedback to adjust TEC operation in real-time, maintaining accurate temperature control despite variations in air gap height, thereby achieving precision without requiring manual air gap maintenance.
Solution Approach 2:
The patent replaces mechanical air gap measurement and control methods with optical IR sensing. Instead of mechanically measuring or maintaining the air gap, the system uses IR radiation to non-contactly measure temperature and infer air gap conditions, substituting mechanical complexity with optical sensing simplicity while maintaining precision.
3Loss of information
If the reticle is repeatedly removed and repositioned for temperature measurement, then temperature data can be obtained, but the process efficiency decreases significantly
Solution Approach 1:
The patent merges the temperature measurement function with the cooling structure by integrating IR sensors into the TEC array. This combination eliminates the need for separate measurement operations that require reticle removal and repositioning, allowing continuous cooling while simultaneously acquiring temperature data, thereby maintaining high productivity.
Solution Approach 2:
The integrated sensing system enables continuous temperature monitoring throughout the cooling process without interrupting the cooling action. Both the cooling and measurement functions operate continuously and simultaneously, eliminating the repeated start-stop cycles that would reduce productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy and efficiency of reticle cooling by allowing continuous monitoring and adjustment during the process, ensuring the reticle reaches the target temperature quickly and accurately without disrupting the heat transfer operation.
Implementation Method 1
The reticle is arranged to emit radiation... At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the reticle
Implementation Method 2
a heat exchanger that includes an array of thermoelectric chips (TECs) may be used to carry heat away from the reticle... the ability to make non-contact measurements of a reticle surface during a heat transfer operation
Data Source
AI summary
According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.