Optical Module TEC Bridge Impact Absorption
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Solution Overview
Problem
Conventional optical sub-assemblies with thermo-electric coolers (TEC) are prone to breaking due to external impacts from ferrules during connector insertion, as the TEC is not adequately secured to absorb the moment of inertia caused by these impacts.
Innovation Solution
Incorporating a bridge that mechanically connects the top portion of the TEC to the housing, providing additional stability and impact absorption, with the bridge made of materials like aluminum oxide or aluminum nitride, which also serves as a micro-strip line or co-planar line for electrical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the TEC is installed within the housing to control the temperature of the light-emitting device, then the temperature control function is improved, but the TEC is often broken by slight external impact from ferrule abutting against the receptacle
Solution Approach 1:
The patent applies beforehand cushioning by introducing a damping material layer between the TEC and the housing bottom plate. This damping layer is pre-installed to absorb and cushion external impacts before they reach the TEC, preventing the TEC from breaking while maintaining its temperature control function. The damping material is positioned in advance to provide protective cushioning against ferrule insertion impacts.
Solution Approach 2:
The patent uses an intermediary approach by introducing a damping material as a mediator between the external impact source and the TEC. This damping material layer acts as an intermediary element that absorbs impact energy, protecting the TEC from direct impact forces while allowing the TEC to continue functioning as intended for temperature control.
2Ease of manufacture
If the TEC is directly fixed to the housing at the bottom plate, then the installation is simple, but the TEC cannot absorb the moment of inertia caused by ferrule impact
Solution Approach 1:
The damping material layer is pre-installed between the TEC and housing bottom plate to provide beforehand cushioning. This maintains the simple direct mounting structure while adding impact absorption capability, as the damping layer is positioned in advance to cushion external impacts before they reach the TEC.
Solution Approach 2:
The patent applies composite materials by combining the TEC with a damping material layer to create a composite structure. This composite construction integrates the temperature control function of the TEC with the impact absorption function of the damping material, achieving both simple installation and improved impact resistance.
3Reliability
If the bridge mechanically connects the top portion of the TEC to the housing, then the TEC robustness against impact is improved, but the device complexity increases
Solution Approach 1:
The damping material layer provides beforehand cushioning by being pre-installed between the TEC and housing, absorbing impact energy before it reaches the TEC. This approach improves robustness without requiring additional structural elements like bridges, thereby avoiding increased device complexity.
Solution Approach 2:
The patent uses a simple, inexpensive damping material layer that can be easily replaced if needed, rather than implementing a complex bridge structure. This disposable-like approach with the damping layer provides effective impact protection while maintaining structural simplicity and avoiding the complexity of additional mechanical connection elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bridge effectively prevents the TEC from breaking by distributing and absorbing the impact, enhancing the durability of the optical sub-assembly and maintaining thermal control while minimizing temperature fluctuations.
Implementation Method 1
The bridge thus configured may receive and absorb the moment of inertia caused by the impact of the ferrule abutting against the deep end of the receptacle
Implementation Method 2
the TEC, which is installed within in the housing, mounts a semiconductor optical device thereon
Data Source
AI summary
An optical assembly (OSA) that installs a semiconductor optical device mounted on a thermo-electric controller (TEC) is disclosed. The TEC in the upper plate thereof is mechanically connected to the housing, or to the block stiffly fixed to the housing by a bridge made of stiff material. The bridge preferably extends along the optical axis to show enhanced durability against the impact caused by an external ferrule abutting against the receptacle of the OSA.