TEC Heat Dissipation Assembly With Sealed Cold End Venting
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Solution Overview
Problem
Existing heat dissipation systems for projection devices face inefficiencies due to sealed cavities trapping heat, leading to reduced performance and reliability, and high material and production costs due to precise machining requirements.
Innovation Solution
A heat dissipation assembly with a TEC where only the cold end is sealed, allowing the hot end to dissipate through convection, combined with insulation and conductive layers to enhance efficiency and reduce material usage and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the TEC cavity is fully sealed to protect the cold end, then the cold end is protected from moisture and heat, but the hot end cannot dissipate heat effectively through convection
Solution Approach 1:
The sealing structure is divided into two parts: the cold end cavity is sealed with a sealing ring to protect from moisture, while the hot end remains open for convection heat dissipation. This segmentation allows each end to have its own optimized environment.
Solution Approach 2:
Different sealing properties are applied to different parts of the TEC: the cold end has a sealed cavity structure for protection, while the hot end has an open structure for heat dissipation. The heat insulation layer is also applied locally at the cold end edge.
2Reliability
If a sealing member is used to seal the TEC cavity, then the cold end is protected, but the material consumption and production cost increase
Solution Approach 1:
The sealing function is extracted from a traditional sealing member and implemented using a heat insulation sealant layer applied only at the cold end edge. This eliminates the need for a separate sealing member, reducing material consumption and cost.
Solution Approach 2:
The heat insulation sealant layer serves as a simple, cost-effective sealing solution compared to traditional sealing members. It is easier to manufacture and requires less precision, reducing production costs.
3Reliability
If a sealing member is used to seal the TEC cavity, then the cold end is protected, but the production yield decreases due to TEC damage from excessive pressure
Solution Approach 1:
The sealing function is transferred from a rigid sealing member to a flexible heat insulation sealant layer, which does not create excessive pressure on the TEC during assembly, eliminating the cause of production defects.
Solution Approach 2:
The heat insulation sealant layer acts as a cushioning layer that prevents excessive pressure from being applied to the TEC during assembly, protecting the TEC from damage before the sealing is even completed.
4Temperature
If the cold end is fully sealed to prevent heat transfer, then the cold end temperature is maintained, but the heat dissipation efficiency of the cold end decreases
Solution Approach 1:
Heat insulation is applied locally only at the edge of the cold end where it is needed to prevent unwanted heat transfer from the ambient air, while the main heat dissipation surface remains exposed and efficient.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improved heat dissipation efficiency, reduced production costs, and increased production yield by optimizing TEC sealing and insulation, preventing damage and moisture issues, while maintaining stable operation.
Implementation Method 1
a heat-insulation sealing layer is arranged on an edge of the cold surface of the TEC to seal and thermally insulate on one end of the TEC including the cold surface
Implementation Method 2
one end of the TEC includes a cold surface, and the other end of the TEC includes a hot surface; the hot surface of the TEC is attached to the first heat dissipation component, and the cold surface of the TEC is attached to an assembly to be subjected to heat dissipation
Implementation Method 3
a first heat-conduction layer is arranged between the hot surface of the TEC and the first heat dissipation component
Implementation Method 4
a second heat-conduction layer is arranged between the cold surface of the TEC and the assembly to be subjected to heat dissipation
Implementation Method 5
the second heat dissipation component includes heat dissipation tubes and/or heat dissipation fins
Data Source
AI summary
A heat dissipation assembly and a projection device are disclosed. The heat dissipation assembly includes a thermal electronic cooler (TEC) and a first heat dissipation component, where an end of the TEC includes a cold surface, and the other end thereof includes a hot surface. The hot surface of the TEC is attached to the first heat dissipation component. The cold surface of the TEC is attached to an assembly to be subjected to heat dissipation. A heat-insulation sealing layer is arranged on an edge of the cold surface of the TEC, to seal and thermally insulate the end of the TEC including the cold surface.