TEC-Cooled Laser on PCB with Separate Fiber Mount
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Solution Overview
Problem
Existing optical transmitters and receivers face challenges in efficiently cooling optical components, which can lead to thermal management issues and affect the performance and reliability of the devices.
Innovation Solution
The proposed solution involves an apparatus that includes a printed circuit board with a heat sink, a thermoelectric cooler (TEC) with a laser mounted on it, an optical fiber mount, and optional bulk optical collimating and/or focusing elements, which work together to efficiently cool and align optical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If optical components are assembled inside a sealed package with TEC cooling, then thermal management is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the optical assembly into separate components: the laser is mounted on the TEC module while the optical fiber is mounted separately on the PCB. This segmentation allows independent mounting and cooling of the laser without requiring a sealed package, reducing device complexity while maintaining thermal management.
Solution Approach 2:
The patent extracts the laser from the traditional sealed package and mounts it directly on the TEC module, which is mounted on the PCB. This extraction eliminates the need for a sealed package structure while maintaining effective cooling through the TEC, thereby reducing manufacturing complexity.
2Ease of manufacture
If optical components are mounted on PCB with direct cooling, then manufacturing ease improves, but thermal management effectiveness decreases
Solution Approach 1:
The patent merges the laser mounting and TEC cooling functions into a single integrated structure. The laser is mounted directly on the TEC module, which is mounted on the PCB, creating a combined structure that is easy to manufacture while providing effective thermal management through direct contact with the TEC.
3Temperature
If multiple optical components are mounted on TEC, then cooling efficiency improves, but alignment precision and optical performance deteriorate
Solution Approach 1:
The patent segments the optical components: the laser is mounted on the TEC while the optical fiber is mounted separately on the PCB with independent alignment mechanisms. This segmentation allows each component to be optimized for its specific function - the laser for cooling efficiency and the optical fiber for precise alignment - without compromising either aspect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages thermal issues by using the TEC to cool the optical components, while the optical alignment is maintained through the use of lenses and optical mounts, enhancing the performance and reliability of the optical modules.
Implementation Method 1
A thermoelectric cooler (TEC) may be used to cool the optical components within the sealed package during operation
Implementation Method 2
a heat sink located along a second side of the printed circuit board
Data Source
AI summary
An optical module includes a PCB having an electronic component mounted on a first side thereof. A heat sink is located along a second side of the PCB. A thermoelectric cooler (TEC) is disposed in an opening through the PCB and has a surface adjacent the heat sink. A laser is located at another surface of the TEC in a thermal contact therewith. An optical fiber mount is attached to the first side of the PCB to hold an optical fiber end in optical alignment with the laser.