TEC Heat Dissipation Assembly for Optical Module Tolerance Gaps
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Solution Overview
Problem
The increasing power consumption and heat generation in optical modules due to higher data rates and bandwidths in communications technologies pose a challenge for efficient heat dissipation, as existing solutions struggle to effectively manage thermal resistance and machining tolerances in thermal conduction paths.
Innovation Solution
A heat dissipation assembly comprising a cage, a thermal electric cooling (TEC) assembly, a mounting kit, an elastic carrier, and a heat pipe, where the TEC assembly is positioned outside the cage with a window allowing thermal communication with the heat emitting device, and the elastic carrier ensures close contact through a rebound force, compensating for machining tolerances and facilitating efficient heat transfer via the heat pipe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the optical module operates at higher data rates and bandwidths, then communication performance is improved, but heat generation increases
Solution Approach 1:
The patent extracts the heat dissipation function from the optical module itself by introducing a separate TEC assembly and heat pipe system. The TEC assembly is positioned outside the cage with its cold side extending through a window to contact the optical module, separating the cooling mechanism from the data-generating component while maintaining thermal management effectiveness.
Solution Approach 2:
The patent introduces intermediary components (TEC assembly, heat pipe, elastic carrier) between the heat-generating optical module and the external environment. The TEC assembly acts as a thermal mediator, transferring heat from the optical module through its cold side, while the heat pipe and elastic carrier facilitate heat transfer from the TEC's hot side to external heat sinks.
2Manufacturing precision
If rigid mounting structures are used to ensure thermal contact, then thermal resistance is reduced, but machining tolerances cause contact gaps
Solution Approach 1:
The patent transforms the static rigid mounting structure into a dynamic system with the elastic carrier. The elastic carrier can deform elastically under compression to compensate for dimensional variations and machining tolerances, ensuring reliable thermal contact between the TEC assembly and the optical module regardless of manufacturing variations.
Solution Approach 2:
The patent changes the mechanical parameters of the mounting system by introducing elasticity. The elastic carrier's ability to deform allows the system to adapt to varying contact conditions, maintaining optimal thermal contact pressure despite variations in component dimensions caused by machining tolerances.
3Stability of the object's composition
If the TEC assembly is fixed rigidly, then structural stability is improved, but thermal contact with the optical module is compromised due to tolerance accumulation
Solution Approach 1:
The patent segments the mounting system into distinct functional components: the rigid cage providing structural stability, the elastic carrier providing tolerance compensation, and the TEC assembly providing thermal management. This segmentation allows each component to optimize its specific function while working together as an integrated system.
Solution Approach 2:
The patent creates a composite mounting system combining rigid structural elements (cage) with elastic elements (elastic carrier). This composite structure integrates the advantages of both rigid and flexible components, maintaining structural stability while enabling tolerance compensation for reliable thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces thermal resistance and enhances heat dissipation efficiency by ensuring close contact between the TEC assembly and the heat emitting device, and between the heat pipe and the TEC assembly, effectively managing heat generated by optical modules.
Implementation Method 1
the elastic carrier is configured to: when the heat emitting device is inserted into the cage and applies an extrusion force to the outer side of the cage, and the extrusion force is transferred to the TEC assembly through the window and transferred to the elastic carrier from the TEC assembly, undergo elastic deformation and provide a reaction force to the TEC assembly and the heat emitting device
Implementation Method 2
When an ambient temperature of the heat emitting device is excessively high, the TEC assembly absorbs heat from the heat emitting device on the cold side of the TEC assembly by means of a thermal electric effect, and releases heat on the hot side
Implementation Method 3
a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly, so as to dissipate heat of the TEC assembly by using the heat pipe
Implementation Method 4
thermal resistance between the cold side of the TEC assembly and the heat emitting device is relatively small, and good thermal conduction is implemented. In addition, the rebound force also enables the heat absorption portion of the heat pipe to be in close contact with the hot side of the TEC assembly, so as to reduce thermal resistance between the heat pipe and the hot side of the TEC assembly
Data Source
AI summary
Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.