TEC Dummy Die Structure for Base Die Edge Hotspot Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thermal management in microelectronic packages is challenging due to hotspots at the edges of base dies, which are not adequately cooled by low thermal conductivity mold materials, leading to performance limitations and increased costs with high thermal conductivity materials or complex cooling solutions.
Innovation Solution
Incorporation of thermoelectric cooler (TEC) dummy dies over the edges of base dies to actively cool hotspots by transferring heat from the cold side to the integrated heat spreader, using a glass substrate with alternating P-type and N-type semiconductor vias and conductive traces for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high thermal conductivity mold material is used, then hotspot temperature is reduced, but package cost increases
Solution Approach 1:
The patent introduces TEC dummy dies as intermediary components between the base die edges and the IHS. These dummy dies act as thermal mediators that actively pump heat away from hotspot regions through thermoelectric cooling, providing an alternative heat transfer path that does not require expensive high thermal conductivity mold materials throughout the entire package structure.
Solution Approach 2:
The patent changes the thermal management approach by transforming passive thermal conduction through mold material into active thermoelectric cooling. By changing the physical state and mechanism of heat transfer (from passive conduction to active Peltier effect), the system achieves hotspot temperature reduction without requiring high thermal conductivity mold materials, thus avoiding increased package cost.
2Temperature
If liquid cooling is implemented, then hotspot temperature is reduced, but package complexity increases
Solution Approach 1:
The patent replaces complex mechanical liquid cooling systems with solid-state thermoelectric cooling devices. The TEC dummy dies use electrical energy to drive the Peltier effect, substituting mechanical pumps, channels, and fluid management systems with a simpler solid-state solution that integrates directly into the package structure without requiring additional cooling infrastructure.
Solution Approach 2:
The TEC dummy dies serve multiple functions: they provide thermoelectric cooling for hotspot management, maintain structural integrity of the package, and can be integrated into existing package architectures without requiring separate cooling subsystems. This multi-functionality reduces overall package complexity compared to dedicated liquid cooling systems.
3Temperature
If compute die thickness is decreased, then hotspot temperature is reduced, but thermal coupling to IHS deteriorates
Solution Approach 1:
The patent segments the thermal management function by separating hotspot cooling (at base die edges) from overall thermal coupling (through compute dies to IHS). TEC dummy dies are placed specifically at hotspot regions to provide localized cooling, while the compute dies maintain their thickness and continue to provide robust thermal coupling to the IHS, thus resolving the contradiction between localized temperature reduction and overall thermal coupling integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces or eliminates hotspots, improving package performance while avoiding the cost and complexity of alternative cooling methods, and maintaining reliability of components like photonics dies susceptible to temperature fluctuations.
Implementation Method 1
Thermoelectric cooler (TEC) dummy dies over the edges of base dies to actively cool hotspots by transferring heat from the cold side to the integrated heat spreader
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
Embodiments disclosed herein include thermoelectric cooling (TEC) dies for multichip packages. In an embodiment, a TEC die comprises a glass substrate and an array of N-type semiconductor vias and P-type semiconductor vias through the glass substrate. In an embodiment, conductive traces are over the glass substrate, and individual ones of the conductive traces connect an individual one of the N-type semiconductor vias to an individual one of the P-type semiconductor vias.