Thermoelectric Cooler Thermal Isolation for HBM and CPU

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Solution Overview

Problem

High-bandwidth memory (HBM) chips in integrated circuit packages face overheating issues due to thermal cross-talk with adjacent CPU/GPU dies, which are cooled by shared integrated heat sinks, leading to performance loss.

Innovation Solution

Integration of a thermoelectric cooler (TEC) into the integrated heat sink (IHS) to thermally isolate the HBM from the CPU/GPU, using low thermal conductivity thermoelectric material to restrict heat flow and actively pump heat from HBM to CPU when powered, thereby controlling thermal cross-talk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a shared integrated heat sink is used to cool both CPU/GPU and HBM, then the package size is reduced, but thermal cross-talk causes HBM overheating

Engineering Contradiction:

Improvepackage sizeVSAvoidHBM temperature

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The integrated heat sink is segmented into two thermally isolated zones by inserting a thermoelectric cooler between them. The first zone cools the CPU/GPU while the second zone cools the HBM, preventing thermal cross-talk while maintaining a compact package structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A thermoelectric cooler is inserted as an intermediary component between the CPU/GPU heat sink and the HBM heat sink. This mediator actively pumps heat away from the HBM side and prevents thermal energy from the CPU/GPU side from reaching the HBM, thus eliminating thermal cross-talk.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If thermoelectric cooler is integrated into the heat sink, then thermal cross-talk is reduced, but device complexity increases

Engineering Contradiction:

Improvethermal cross-talk controlVSAvoidheat sink structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermoelectric cooler is merged with the integrated heat sink structure, combining the cooling function with the thermal management system. This integration allows the TEC to be embedded within the heat sink rather than being a separate component, reducing overall system complexity while maintaining thermal isolation effectiveness.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The TEC effectively reduces HBM temperatures by throttling thermal energy pathways and providing active cooling, maintaining optimal operating temperatures for both CPU and HBM, enhancing overall system performance.

Implementation Method 1

using low thermal conductivity thermoelectric material to restrict heat flow and actively pump heat from HBM to CPU when powered

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

using low thermal conductivity thermoelectric material to restrict heat flow

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11462457B2Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates

Publication Date: 2022.10.04 INTEL CORP

AI summary

Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.