TEC-Embedded Diode Laser Cooling With Heat Pipe Integration

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Solution Overview

Problem

Current cooling technologies for stacked diode laser assemblies, such as channel-based fluid management systems, are susceptible to erosion, clogging, and occupy significant space, limiting their effectiveness and form factor, especially when trying to reduce the stack pitch for improved brightness.

Innovation Solution

The integration of thermoelectric cooler (TEC) subassemblies within the semiconductor device, utilizing a thermally and electrically conductive substrate with a heat pipe and TEC material elements, allows for active cooling without fluid flow channels, enabling reduced stack pitch and improved thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If channel based fluid management systems are used for cooling, then cooling effectiveness is improved, but device footprint and complexity increase

Engineering Contradiction:

Improveemitter temperatureVSAvoiddevice footprint

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The heat pipe is embedded within the substrate structure, with the working fluid contained inside the heat pipe channels that are integrated into the substrate layers. This nesting approach allows the cooling system to be compact while maintaining effective heat removal from the emitters.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The cooling function is merged with the substrate structure itself. The substrate serves both as the mechanical support for the emitters and as the heat sink with integrated cooling channels, eliminating the need for separate cooling components and reducing overall device footprint.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If channel based fluid management systems are used for cooling, then cooling effectiveness is improved, but susceptibility to erosion and clogging increases

Engineering Contradiction:

Improveemitter temperatureVSAvoidcooling system reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent uses sealed encapsulated channels that prevent fluid contamination and degradation. The cooling fluid is hermetically sealed within the substrate structure, eliminating exposure to external contaminants that would cause erosion and clogging, thereby extending system life and improving reliability.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Illumination intensity

If stack pitch is reduced for improved brightness, then beam brightness is improved, but heat generation increases

Engineering Contradiction:

Improvebeam brightnessVSAvoidheat generation

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The cooling channels are strategically positioned in high-heat-generation areas, with channels located directly beneath and adjacent to the emitter stacks. The channel cross-sections are optimized locally to match the heat flux distribution, providing enhanced cooling where needed most while maintaining compact pitch.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the temperature of diode laser emitters, maintains a compact form factor, and enhances the brightness of the beam produced by the stacked diode laser assembly, while being compatible with existing semiconductor manufacturing processes.

Implementation Method 1

A TEC material element may also be included which has a first surface and a second surface, and which is configured to be positioned at least partially against the second surface of the substrate

Methodology Applied

Scientific EffectPeltier Effect: Peltier Effect

Implementation Method 2

A heat pipe may be included which has a first portion and a second portion, where the first portion is configured to be in thermal contact with the second surface of the TEC material, and the second portion is configured to sink heat generated by the die and transmitted through the substrate and the TEC material

Methodology Applied

Scientific EffectHeat Pipe: Heat Pipe

Implementation Method 3

A substrate having a first surface and a second surface and constructed of a thermally and electrically conductive material

Methodology Applied

Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS20240243545A1Systems and methods for cooling high power devices

Publication Date: 2024.07.18 LAWRENCE LIVERMORE NAT SECURITY LLC

AI summary

The present disclosure relates to a thermoelectric cooling (TEC) embedded electronics system. In one embodiment the system has a substrate having a first surface and a second surface and constructed of a thermally and electrically conductive material, and a die. The die is configured to be supported from the first surface of the substrate and in thermal contact with the substrate. The die forms a heat generating component. A TEC material element is used which has a first surface and a second surface and is configured to be positioned at least partially against the second surface of the substrate. A heat pipe is provided which has a first portion and a second portion. The first portion is configured to be in thermal contact with the second surface of the TEC material, and the second portion is configured to sink heat generated by the die and transmitted through the substrate and the TEC material element.