Thermoelectric Cooler Thermal Control for LED Burn-in Testing
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Solution Overview
Problem
Conventional air-driven High Temperature Operating Life (HTOL) chambers are unable to dissipate the significant heat generated by high power devices such as Light Emitting Diodes (LEDs) and semiconductors, limiting the number of devices that can be tested simultaneously and increasing the cost and cycle time of burn-in tests.
Innovation Solution
A thermal control and management system utilizing a thermoelectric cooler (TEC) sandwiched between top and bottom cold plates, with a PID controller to regulate temperature, allowing for simultaneous heating or cooling of multiple devices under test, and enabling real-time monitoring and management of thermal impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional air-driven HTOL chambers are used for testing high power devices, then the testing can be performed with simple equipment, but the heat dissipation capability is insufficient, limiting test capacity and increasing cycle time
Solution Approach 1:
The system divides the testing function into multiple independent test stations arranged in a linear array, each capable of testing devices independently. This segmentation allows simultaneous testing of multiple devices, increasing overall test capacity while maintaining the simplicity of individual test stations.
Solution Approach 2:
Thermoelectric coolers are introduced as intermediary components between the test devices and the heat dissipation system. These coolers actively manage heat transfer, enabling effective heat dissipation from multiple devices simultaneously, thus increasing productivity without compromising equipment simplicity.
2Ease of manufacture
If conventional air-driven HTOL chambers are used, then the equipment cost is lower, but the heat dissipation limitation increases the cost and cycle time of burn-in tests
Solution Approach 1:
The thermoelectric coolers operate continuously to maintain optimal temperature conditions for all test devices simultaneously. This continuous active cooling prevents heat buildup that would otherwise extend burn-in cycle times, enabling faster and more efficient testing while keeping equipment costs relatively low.
Solution Approach 2:
The system changes the thermal parameters of the testing environment by introducing active thermoelectric cooling. This allows precise control of temperature conditions, reducing the time required for burn-in tests to reach completion while maintaining cost-effective equipment.
3Productivity
If multiple high power devices are tested simultaneously in conventional chambers, then test capacity increases, but heat dissipation becomes insufficient, affecting test accuracy
Solution Approach 1:
Each test station in the linear array has its own dedicated thermoelectric cooler, providing localized thermal management. This ensures that heat dissipation requirements of each device are met independently, maintaining test accuracy even when multiple high-power devices are tested simultaneously, thus preserving reliability while increasing productivity.
4Temperature
If thermoelectric coolers are used for thermal control, then heat dissipation and temperature regulation improve, but device complexity increases
Solution Approach 1:
The thermoelectric coolers serve multiple functions: they provide active cooling, enable heat dissipation, and facilitate temperature regulation across all test stations. This multi-functionality justifies the increased device complexity by delivering comprehensive thermal control capabilities that enable simultaneous testing of multiple high-power devices with accurate temperature management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates and regulates heat, increasing test capacity and reducing costs by allowing for simultaneous testing of multiple high power devices while preventing overheating and ensuring accurate burn-in results.
Implementation Method 1
Thermo-electric cooler (TEC) or thermoelectric cooling uses the Peltier effect to create a heat flux, between the junctions of two different types of materials
Data Source
AI summary
The present invention relates generally to a system and a method for thermal control. More particularly, the invention encompasses an apparatus for thermal control and management of at least one device under test (DUT). The inventive thermal control and management apparatus also allows for the management of a plurality of devices under test, and with each device under test having its own testing regimen. The thermal control and management of the device under test (DUT) is managed using at least one thermoelectric element or cooler (TEC), which can be used to either heat or cool the corresponding device under test (DUT).