TEC Local Hermetic Sealing for Non-Hermetic Optical Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing TEC products in the market are designed for hermetic environments and fail in non-hermetic environments due to moisture-induced corrosion, leading to short circuits and open circuits, which is a reliability issue in optical communication systems.
Innovation Solution
A semiconductor cooler with a metal BOX structure providing a local hermetic effect, eliminating the need for a waterproof film, where the positive and negative electrodes are fixed on the cold surface, and a groove in the optical BOX packaging creates a sealed space with an insulating low thermal conductivity sealing ring, ensuring the TEC operates effectively in non-hermetic conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TEC is coated with waterproof film in non-hermetic environment, then waterproof protection is provided, but the film is easily damaged and reliability deteriorates
Solution Approach 1:
The patent divides the TEC structure into separate functional surfaces: the hot surface area is larger than the cold surface area, creating distinct zones for heat dissipation and device mounting. This segmentation allows the hot surface to extend beyond the cold surface boundaries, providing structural support and heat dissipation pathways that protect against moisture intrusion without requiring fragile waterproof films.
Solution Approach 2:
The patent introduces an intermediary protective structure where the extended hot surface acts as a barrier against moisture. The hot surface extends beyond the cold surface to create an overhang that prevents moisture from directly contacting the electrodes and pads on the cold surface, eliminating the need for vulnerable waterproof film coatings.
2Adaptability or versatility
If TEC operates in non-hermetic environment, then installation flexibility is improved, but moisture corrosion causes short circuit and open circuit
Solution Approach 1:
The patent applies local quality by creating different functional zones on the TEC surfaces. The hot surface has extended areas that provide both thermal management and protective functions, while the cold surface maintains its electrical functionality. This localized differentiation allows the TEC to operate reliably in non-hermetic environments without compromising electrical connections.
Solution Approach 2:
The patent utilizes dimensional arrangement by positioning the hot surface and cold surface in overlapping configurations where the hot surface extends beyond the cold surface boundaries. This spatial arrangement creates a protective geometry that shields electrical components from moisture while maintaining operational flexibility in non-hermetic installations.
3Temperature
If hot surface area is larger than cold surface area, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent makes the hot surface serve multiple functions: it acts as both a thermal management surface and a protective barrier against moisture. The extended hot surface area provides heat dissipation while simultaneously creating a physical shield that prevents moisture contact with electrical components, eliminating the need for separate protective structures and reducing overall device complexity.
Solution Approach 2:
The patent merges the protective function with the heat dissipation function by making the hot surface extension serve both purposes. Instead of adding separate protective components, the design combines moisture protection and thermal management into a single integrated surface configuration, simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and performance of TECs in non-hermetic environments, allowing for batch production and easy interchangeability while maintaining high thermal conductivity and insulation, thus addressing the limitations of existing TECs.
Implementation Method 1
a semiconductor cooler which comprises a positive electrode, a negative electrode, a hot surface, a cold surface and a plurality of thermo sensitive elements fixed between the first surface of the hot surface and the first surface of the cold surface
Implementation Method 2
an insulating low thermal conductivity sealing ring is disposed between a lower end of a cold surface of the semiconductor cooler and the BOX packaging
Data Source
AI summary
The present invention provides a multichannel parallel light emitting device comprising a semiconductor cooler, a cold surface of the semiconductor cooler completely covers the area of a hot surface, and when the hot surface and the cold surface are horizontally disposed, a horizontal distance is reserved between the edge of the cold surface and the edge of the hot surface, and a positive electrode and a negative electrode are fixed on a second surface of the cold surface. The semiconductor cooler with the above structure is disposed in a sealed BOX of a BOX package, the bottom surface of the inner wall of the BOX package is provided with a groove for mounting a semiconductor cooler, a hot surface of the semiconductor cooler is fixed at the bottom of the groove, an insulating low thermal conductivity sealing ring is disposed between a lower end of a cold surface of the semiconductor cooler and the BOX package, so that the BOX package, the insulating low thermal conductivity sealing ring and the cold surface of the semiconductor cooler form a closed space, so as to achieve the TEC local hermetic effect, a water-proof film is not required for the TEC, and to ensure the TEC can work in a non-hermetic environment.