Thermoelectric Coolers with Phase-Change Material for IC Thermal Management
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Solution Overview
Problem
High-performance integrated circuits face heat management challenges due to high power densities and thermal resistance issues, particularly in package-on-package architectures where heat flow from lower dies to thermal solutions is impeded, leading to potential overheating during burst activities.
Innovation Solution
A package-integrated thermoelectric latent heat absorption device with a phase change material (PCM) layer and integrated thermoelectric coolers (TECs) that absorbs heat during burst activities, prolonging the phase transition duration by actively removing heat from the PCM, thus delaying complete melting and extending the duration of latent heat absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat conduction through the die and thermal interface material is used, then heat transfer path is simple, but thermal resistance is large limiting heat transfer efficacy
Solution Approach 1:
The thermal management system is segmented into multiple functional layers: phase-change material layer for latent heat absorption, thermoelectric cooler layer for active heat pumping, and heat spreader layer for heat distribution. This segmentation allows each layer to address specific thermal challenges, improving overall heat transfer efficacy while managing complexity through modular design
Solution Approach 2:
The invention employs composite thermal management architecture combining phase-change materials (for latent heat storage), thermoelectric materials (for active cooling), and heat spreader materials (for thermal distribution). This composite approach integrates multiple heat transfer mechanisms to overcome the limitations of conventional single-path conduction
2Volume of moving object
If package-on-package architecture with vertical stacking is used, then form factor is smaller, but heat flow from lower dies is impeded leading to overheating
Solution Approach 1:
A phase-change material layer is introduced as an intermediary between the lower die and the thermoelectric cooler. This intermediary absorbs excess heat through phase transition, preventing direct heat transfer paths that would cause overheating in tightly stacked PoP architectures, while maintaining compact vertical integration
Solution Approach 2:
The phase-change material undergoes solid-liquid phase transition to absorb latent heat from the lower die in the PoP stack. This phase transition mechanism provides high heat capacity in a thin layer, enabling effective thermal management in compact vertical architectures without increasing form factor
3Loss of energy
If phase change material is used to absorb heat, then latent heat absorption is effective, but phase transition duration is limited
Solution Approach 1:
The system maintains continuous heat absorption by combining phase-change material (providing latent heat absorption during transition) with thermoelectric coolers (providing continuous active heat pumping). This continuity ensures sustained heat management capability throughout burst activities, extending the effective duration beyond what phase-change alone could achieve
Solution Approach 2:
The invention merges phase-change material heat absorption with thermoelectric cooler heat pumping in a single integrated thermal management system. The PCM handles transient heat spikes through phase transition, while the TEC provides continuous heat removal, creating a synergistic system that extends operational duration
4Duration of action of moving object
If thermoelectric coolers actively remove heat from PCM, then phase transition duration is prolonged, but device complexity increases
Solution Approach 1:
The thermal management system dynamically adapts to varying thermal loads by combining the passive phase-change response (which automatically activates at specific temperatures) with actively controllable thermoelectric coolers. This dynamic approach allows the system to extend burst activity duration while managing complexity through intelligent control strategies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat transfer by maintaining a high heat flux with minimal temperature rise, allowing extended burst activity durations and improved thermal management, enabling higher performance levels in high-power ICs by maintaining efficient heat removal and reducing thermal resistance.
Implementation Method 1
A package-integrated thermoelectric latent heat absorption device with a phase change material (PCM) layer and integrated thermoelectric coolers (TECs) that absorbs heat during burst activities, prolonging the phase transition duration
Implementation Method 2
a package-integrated thermoelectric latent heat absorption device with a phase change material (PCM) layer that absorbs heat during burst activities
Implementation Method 3
integrated thermoelectric coolers (TECs) that absorbs heat during burst activities, prolonging the phase transition duration by actively removing heat from the PCM
Data Source
AI summary
An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.