Thermoelectric Cooler Segmented Top Plate for Optical Alignment
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Solution Overview
Problem
Existing thermoelectric coolers (TECs) in optical transceivers face challenges with thermal management, as the reflowing of solder material during the soldering process can cause uneven mounting surfaces, leading to misalignment of optical components and limited thermal performance due to the use of expensive high-thermal-conductivity materials, which increases manufacturing costs.
Innovation Solution
A TEC design with asymmetrical thermal performance, featuring a top plate made of high thermal conductivity material and a bottom plate made of low thermal conductivity material, allowing for thermally isolated mounting sections to prevent reflow and maintain component alignment, while using low-cost materials like Alumina for improved thermal performance and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder material is reflowed during the soldering process to attach optical components, then the optical components are securely attached, but the mounting surface becomes uneven causing misalignment of components
Solution Approach 1:
The top plate is divided into multiple mounting sections (first mounting section, second mounting section, third mounting section) that are thermally isolated from each other. This segmentation allows different attachment methods to be used on different sections - soldering on the first section while protecting the second and third sections from heat, thereby maintaining their mounting surface flatness and preventing misalignment.
Solution Approach 2:
Thermal isolation structures (such as thermal barriers or insulating materials) are introduced between mounting sections to prevent heat transfer during the soldering process. These intermediaries protect the non-soldered mounting sections from thermal exposure, preventing the solder material from flowing onto protected sections and maintaining their surface flatness for precise component alignment.
2Temperature
If high thermal conductivity materials are used in the TEC to improve thermal performance, then wavelength stabilization is enhanced, but manufacturing costs increase
Solution Approach 1:
Different thermal conductivity materials are used in different regions of the TEC structure. High thermal conductivity materials are used only where maximum heat transfer is critical (such as the bottom plate or specific thermal pathways), while lower cost materials are used in other regions. This local differentiation maintains effective wavelength stabilization while reducing overall manufacturing costs.
Solution Approach 2:
The TEC employs composite material construction combining different materials with varying thermal conductivity properties. This allows optimization of thermal performance in critical areas while using cost-effective materials in non-critical areas, achieving a balance between wavelength stabilization performance and manufacturing cost.
3Ease of manufacture
If a single mounting surface is used on the TEC, then manufacturing is simplified, but thermal isolation of different components cannot be achieved
Solution Approach 1:
The top plate is segmented into multiple thermally isolated mounting sections, each capable of independent temperature control. This segmentation enables different thermal environments for different optical components (such as lasers requiring cooling while other components operate at ambient temperature), achieving thermal isolation while maintaining a relatively simple monolithic plate structure for ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal conductivity and flexibility in optical transceivers, reduces manufacturing costs, and maintains component alignment by using thermal epoxy for attaching sensitive components, achieving temperature control without stress fractures or power losses.
Implementation Method 1
a thermoelectric cooler (TEC) having a first plate, a second plate, and a plurality of semiconductor elements disposed therebetween
Data Source
AI summary
In general the present disclosure is directed to a temperature control device, e.g., a TEC, that includes a top plate with at least first and second contact pads to allow for a soldering process to attach optical components to the first contact pad without causing one or more layers of the second contact pad to reflow and solidify with an uneven mounting surface. Thus, optical components such as a focus lens can be mounted to the second contact pad via, for instance, thermal epoxy. This avoids the necessity of a submount to protect the focus lens from the relatively high heat introduced during a soldering process as well as maintain the flatness of the second contact pad within tolerance so that the mounted focus lens optically aligns by virtue of its physical location/orientation with other associated optical components coupled to the first contact pad, e.g., a laser diode.