Tec-Cell Carrier Modularity for FOUP Density and Contamination

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Solution Overview

Problem

Conventional Front Opening Unified Pods (FOUPs) are inefficient in holding wafers at high density, prone to contamination, and lack features for efficient production and processing, failing to meet the needs of modern semiconductor manufacturing.

Innovation Solution

The development of Tec-Cell carriers and systems that provide high or low density compatibility, allowing for interchangeable and self-contained modules that can be housed within FOUPs or other containers, reducing contamination and improving handling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional FOUPs are used to store and transport wafers, then wafers can be isolated and held, but they cannot hold wafers at high density and are prone to contamination

Engineering Contradiction:

Improvewafer densityVSAvoidcontamination

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The FOUP is divided into multiple independent modules or compartments, each capable of holding wafers. This segmentation allows for higher overall density while isolating potential contamination sources to specific modules rather than the entire container.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple carrier rings or substrate holders are nested within the FOUP structure, with smaller containers fitting inside larger ones. This nesting approach maximizes the use of internal space to achieve high wafer density while maintaining isolation between different wafer groups.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Productivity

If conventional FOUPs are used, then wafers can be stored, but loading and unloading is delayed due to multifarious construction

Engineering Contradiction:

Improveloading and unloading speedVSAvoidconstruction complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The FOUP construction is segmented into standardized, interchangeable modules. This modularity simplifies the overall construction while enabling faster loading and unloading, as robots can efficiently handle individual modules rather than complex monolithic structures.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The FOUP incorporates movable or adjustable components such as retractable fins, movable carriers, or adjustable clamps. These dynamic elements allow for rapid loading and unloading operations while maintaining structural integrity, reducing the time wafers spend in transit.

Inventive Principle:

Principle #15Dynamics

3Productivity

If Tec-Cell carriers are designed for high density, then production efficiency improves, but compatibility with legacy and third party systems decreases

Engineering Contradiction:

Improveproduction efficiencyVSAvoidsystem compatibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The Tec-Cell carrier is designed with universal interface features and standardized dimensions that enable it to function in both high-density configurations and legacy FOUP systems. This multi-functionality allows the same carrier design to achieve high production efficiency while maintaining compatibility with existing infrastructure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The carrier design allows nested or stacked configurations that can adapt to different system requirements. The same carrier can be used in high-density nested arrangements for improved productivity or in traditional single-layer configurations for legacy system compatibility.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Reliability

If FOUPs use traditional design, then they can preserve wafers from environment, but they lack features aiding in cleanliness and efficiency

Engineering Contradiction:

Improvewafer protectionVSAvoidcleanliness and efficiency features

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The FOUP is divided into modular sections with independent environmental controls and protective features. This segmentation allows for improved cleanliness through localized maintenance and reduces efficiency bottlenecks by allowing independent operation of different modules.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The FOUP incorporates self-cleaning features, automated monitoring systems, and self-diagnostic capabilities that reduce manual intervention. These self-service features improve both cleanliness and operational efficiency while maintaining reliable wafer protection.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS10734268B1Modularity of Tec-Cell, FOUP and substrate containers and carriers

Publication Date: 2020.08.04 MURATA MASCH LTD

AI summary

Methods, systems and apparatuses for an improved wafer and substrate carrier or container with improved modularity. More specifically, to a carrier or container with improved abilities which may provide high or low density carriers or containers with improved interchanging and compatibility, including for Tec-Cells, FOUPs, and other third party containers, carriers, modules, rings or any other systems, structures, apparatuses, or methods associated. The invention may provided an ability to interchange or be cross-compatible such as wherein Tec-Cell carriers, containers, rings or modules may be provided to be housed in a FOUP or other third party carrier or wherein substrates or wafers held in the Tec-Cell Carriers, rings, containers, or modules, and then held within the FOUP.