Flexible Heat Pipe Assembly for Telecom Node Thermal Bottlenecks

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Solution Overview

Problem

Previous remote unit designs for distributed antenna systems are rigid, limiting flexibility in dimensions and configuration, and inadequate for cooling high heat dissipation components, particularly the signal processing board, which requires more efficient heat management.

Innovation Solution

A flexible node design with adjustable housing dimensions and additional heat pipes extending from high power dissipation components to a cooling section, allowing for variable assembly configurations and improved heat dissipation, including the use of heat pipes with water or other mediums to efficiently transfer heat from both power amplifier modules and signal processing boards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional rigid block section design is used, then structural stability is maintained, but flexibility in dimensions and configuration is limited

Engineering Contradiction:
Improveflexibility in dimensions and configurationVSAvoidstructural stability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The housing is divided into a first housing section and a second housing section that can be independently configured and assembled. This segmentation allows each section to be optimized for specific functions (passive components in first section, high power dissipation components in second section) while maintaining overall structural stability through the coupling mechanism.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The housing design transitions from a fixed rigid structure to a flexible configurable structure. The first and second housing sections can be independently sized and configured based on specific application requirements, allowing the overall assembly to adapt to different dimensional and configuration needs while maintaining structural integrity through the coupling mechanism.

Inventive Principle:
Principle #15Dynamics

2Temperature

If passive cooling is used for low power dissipation components, then device complexity is reduced, but heat dissipation capability is insufficient for high power components

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Different cooling approaches are applied to different sections based on their specific heat dissipation needs. The first housing section with low power dissipation components can use passive cooling or natural convection, while the second housing section with high power dissipation components incorporates active cooling mechanisms such as heat pipes and fans, optimizing the overall cooling efficiency without unnecessarily complicating the entire system.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The cooling system is segmented to match the thermal requirements of different component sections. The first housing section and second housing section can have independent cooling arrangements, allowing passive cooling for low-power areas and active cooling for high-power areas, thereby managing heat dissipation effectively while controlling overall system complexity.

Inventive Principle:
Principle #1Segmentation

3Temperature

If heat pipes extend through tight plate seals, then sealing integrity is maintained, but heat transfer efficiency is reduced

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidsealing integrity
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heat pipes are extracted from the traditional path of extending through the tight plate seal. Instead, the heat pipes are contained within the second housing section, and the tight plate seal is used solely for sealing purposes without heat pipe penetration. This separation allows the seal to maintain its integrity while the heat pipes can be optimally configured for heat transfer efficiency within the enclosed second housing section.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The housing structure itself acts as an intermediary, providing a thermal path for heat pipes without requiring them to penetrate the seal. The second housing section encloses the heat pipes and high power dissipation components, allowing heat transfer to occur within this enclosed space while the tight plate seal maintains sealing integrity between housing sections without being compromised by heat pipe penetration.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible design enables better heat management and adaptability to various applications, accommodating different dimensional requirements and effectively cooling high heat dissipation components, enhancing the performance of telecommunications system nodes.

Implementation Method 1

a first plurality of heat pipes extending from the one or more power amplifier modules to the cooling section. The node further includes a second plurality of heat pipes extending from the first section into the second section

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

The heat sinks and the top end of heat pipes are exposed to the environmental air so fans and/or the outside air cool down the heat sinks

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

The heat sinks and the top end of heat pipes are exposed to the environmental air so fans and/or the outside air cool down the heat sinks

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP3861840B1Flexible heat pipe cooled assembly
Publication Date: 2024.04.03 ANDREW WIRELESS SYSTEMS GMBH(DE)
  • EP3861840B1 patent drawingFigure 1
  • EP3861840B1 patent drawingFigure 2
  • EP3861840B1 patent drawingFigure 3

AI summary

In an example, a node of a telecommunications system includes a first section having one or more passive components; a second section including one or more power amplifier modules and a power supply, wherein the second section is coupled to the first section using fasteners; a distribution unit including a plate and a circuit board, wherein the second section is coupled to the distribution unit using fasteners; a cooling section; a first plurality of heat pipes extending from the one or more power amplifier modules to the cooling section; a second plurality of heat pipes extending from the first section into the second section; and a housing enclosing the first section and the second section.