Telescopic End Effector for Warped Substrate Positioning

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Automated handling systems face challenges in managing thin, nominally planar yet warped substrates, as existing robotic mechanisms struggle to accurately position identifying marks within the depth of field of imaging sensors, leading to data collection failures.

Innovation Solution

The implementation of a thin end effector with telescopic rear gripping members and locating posts ensures that warped substrates are securely positioned to maintain the identifying mark within the depth of field of the code reader, using a combination of vacuum gripping and adjustable positioning to accommodate non-planar shapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If typical robotic handling mechanisms are used to manage thin, warped substrates, then the substrates can be transported, but the identifying marks cannot be accurately positioned within the depth of field of imaging sensors

Engineering Contradiction:

Improvepositioning accuracy of identifying marksVSAvoidability to handle non-planar substrates

Core Design Contradiction:

Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The end effector incorporates telescopic rear gripping members that can dynamically adjust their position along the substrate surface. This dynamic adjustment capability allows the system to accommodate varying degrees of substrate warpage while maintaining consistent positioning of identifying marks within the sensor's depth of field, resolving the contradiction between measurement precision and adaptability to non-planar surfaces.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the physical parameters of the gripping mechanism by allowing the rear gripping members to telescope in and out. This parameter change enables the end effector to adapt to different substrate warpage conditions, maintaining accurate mark positioning across varying substrate geometries without sacrificing measurement precision.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If a thin end effector with telescopic gripping members is used to accommodate warped substrates, then adaptability to non-planar shapes is improved, but device complexity increases

Engineering Contradiction:

Improveability to handle warped substratesVSAvoidcomplexity of end effector mechanism

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The end effector is segmented into multiple independent gripping members, with the rear members having telescopic capability. This segmentation allows each gripping member to independently adapt to substrate warpage while maintaining overall system simplicity. The modular telescopic mechanism distributes the complexity across discrete, manageable components rather than requiring a monolithic complex structure.

Inventive Principle:

Principle #1Segmentation

3Reliability

If vacuum gripping is used to secure thin substrates, then handling reliability is improved, but substrate damage risk increases due to suction forces

Engineering Contradiction:

Improvehandling reliabilityVSAvoidsubstrate damage from vacuum suction

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The vacuum gripping force is segmented and distributed across multiple discrete gripping members rather than concentrated at single points. This distribution of suction forces across the substrate surface reduces the risk of localized damage while maintaining overall handling reliability through the combined effect of multiple gentle contact points.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The gripping members utilize thin, flexible contact surfaces that conform to the substrate without creating high stress concentrations. This flexible contact approach maintains reliable vacuum gripping while minimizing the harmful suction forces that could damage thin, warped substrates.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively ensures that identifying marks on warped substrates are consistently read by the code reader, minimizing errors and substrate damage during processing, while optimizing handling efficiency and accuracy.

Implementation Method 1

using a combination of vacuum gripping and adjustable positioning

Methodology Applied

Scientific EffectVacuum: Vacuum

Data Source

PatentUS10664714B2Substrate handling and identification mechanism

Publication Date: 2020.05.26 ONTO INNOVATION INC

AI summary

A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.