Integrated Ion-Electron Beam System for TEM Sample Preparation
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Solution Overview
Problem
The manufacturing of TEM-samples for transmission electron microscopy is elaborate and difficult due to the need for thin samples that are not easily traversed by electron beams, and existing methods lack efficient apparatuses and methods for forming and analyzing these samples.
Innovation Solution
A particle beam system comprising a first ion beam column for material removal and a second particle beam column for monitoring and control, integrated in a cross-beam system, allows for the formation of strip-shaped recesses and impurity removal in TEM-samples, enabling simple and reliable sample manufacture and analysis without transferring the sample to a separate microscope.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cuboid-shaped material-block is cut out and strip-shaped recesses are formed to create a thin region for TEM analysis, then the material thickness is reduced to enable electron traversal, but the manufacturing process becomes elaborate and difficult
Solution Approach 1:
The patent combines the ion beam processing system and electron microscopy system into a single integrated apparatus. The ion beam column and electron beam column share a common vacuum chamber and control system, allowing both material removal and monitoring functions to be performed in one device. This merging eliminates the need to transfer samples between separate systems and simplifies the overall manufacturing process.
Solution Approach 2:
The patent implements real-time feedback by using the electron beam to monitor the ion beam processing of the material-block. The electron microscopy system continuously images the region being processed by the ion beam, providing immediate visual feedback that allows precise control over the material removal process. This feedback mechanism enables accurate thickness control without requiring complex post-processing measurements.
2Reliability
If the TEM-sample is manufactured using separate ion beam and electron microscopy systems, then material removal and analysis can be performed, but the sample must be transferred between systems which complicates the process
Solution Approach 1:
The patent integrates the ion beam column and electron beam column within a single vacuum chamber and shared control system. Both beam sources are positioned to access the same sample region, allowing continuous processing and analysis without sample removal or transfer. The common vacuum environment and coordinated control eliminate the operational complexity of moving samples between separate systems.
3Manufacturing precision
If strip-shaped recesses are formed at angles to create a thin region, then the region can be traversed by electrons, but the frame surrounding the region may damage the fragile thin region during manipulation
Solution Approach 1:
The electron microscopy system provides real-time imaging feedback during the ion beam processing of the strip-shaped recesses. This allows precise monitoring of the recess formation and the surrounding frame structure, enabling adjustments to ensure the frame adequately supports the thin region without causing damage. The visual feedback helps optimize the recess geometry and frame configuration to protect the fragile area.
4Measurement precision
If the sample is processed and analyzed in separate systems, then specialized equipment can be used for each function, but the overall manufacturing time and complexity increase
Solution Approach 1:
The patent combines ion beam processing and electron beam analysis capabilities in a single integrated apparatus with shared vacuum chamber and control systems. This allows material removal and characterization to occur sequentially or simultaneously on the same sample without transfer time, significantly improving manufacturing speed while maintaining the precision of both specialized functions.
Solution Approach 2:
The integrated system enables continuous processing where the electron beam can immediately monitor and verify the ion beam processing results without interruption. The sample remains in the vacuum chamber throughout the entire process, allowing uninterrupted material removal and real-time verification, eliminating idle transfer time and maintaining continuous productive action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing and analysis of TEM-samples by allowing for in-situ processing and monitoring, reducing the complexity of forming and cleaning the samples, and enabling direct transmission-electron-microscopic analysis within the particle beam system.
Implementation Method 1
a first particle beam column (17) configured to generate a first particle beam (17) incident onto an object region (11) from a first direction, wherein the first particle beam is an ion beam
Implementation Method 2
a second particle beam column (19) configured to generate a second particle beam (19) incident onto an object region (11) from a second direction
Data Source
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AI summary
A method of processing a TEM-sample, wherein the method comprises: mounting an object in a particle beam system such that the object is disposed in an object region of the particle beam system; directing of a first particle beam onto the object region from a first direction, wherein the first particle beam is an ion beam; and then rotating the object about an axis by 180°, wherein the following relation is fulfilled: 35°≤α≤55°, wherein α denotes a first angle between the first direction and the axis; and then directing of the first particle beam onto the object region from the first direction; wherein material is removed from the object during the directing of the first particle beam onto the object region. Furthermore, a second particle beam may be directed onto the object region, and particles emanating from the object region can be detected.