Non-destructive TEM Specimen Size Measurement via Diffraction Geometry
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for measuring the small structural dimensions of semiconductor elements, such as TEM, SEM, and EFTEM, are inefficient, requiring destructive sample preparation, specialized equipment, and complex data analysis, and are not suitable for sizes below 10 nm.
Innovation Solution
A method using a standard transmission electron microscope with adjustable parameters to indirectly measure sample size without damaging the sample, employing an energy source to obtain optimized values and angles for calculating the size, allowing for non-destructive measurement of nano-scale samples.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If SEM method is used to measure sample size, then measurement can be performed, but sample must be transferred between apparatuses causing time loss and damage risk
Solution Approach 1:
The patent combines multiple measurement functions into a single TEM apparatus. The TEM system is configured to perform both diffraction pattern acquisition and direct imaging measurements without requiring sample transfer to SEM, eliminating transfer time and damage risk while maintaining measurement accuracy through integrated multi-mode operation.
Solution Approach 2:
The TEM apparatus is designed with multi-functionality to perform various measurement tasks including diffraction patterns at different tilt angles and direct imaging. This universal capability allows the same apparatus to handle multiple measurement requirements that previously demanded separate specialized instruments like SEM.
2Measurement precision
If SEM method is used to measure sample size, then measurement can be performed, but sample destruction occurs during preparation
Solution Approach 1:
The measurement method uses the sample's own diffraction characteristics and geometric structure to provide measurement information. By analyzing diffraction patterns and tilt angle relationships, the system extracts size data without requiring destructive preparation, allowing the sample to serve itself for measurement purposes.
3Measurement precision
If CBED method is used for measurement, then measurement capability is provided, but specialized equipment and complex analysis are required
Solution Approach 1:
The patent extracts the essential measurement information from complex diffraction patterns by focusing on specific geometric relationships. Instead of requiring full CBED analysis with specialized software, the method extracts size information from the relationship between diffraction pattern dimensions and tilt angles, simplifying the analysis process while maintaining accuracy for small samples.
Solution Approach 2:
The method changes the approach from analyzing complex intensity distributions to measuring geometric parameters. By relating the dimensions of diffraction patterns at different tilt angles to sample size through geometric relationships, the technique simplifies the measurement parameters required while maintaining capability for small size measurement.
4Measurement precision
If EFTEM method is used for measurement, then thickness to size ratio can be obtained, but additional hardware and complex operation are needed
Solution Approach 1:
Instead of using complex energy filtering to directly measure thickness, the patent inverts the approach by using simple geometric relationships from diffraction patterns at different tilt angles. The method inverts the problem from direct thickness measurement to size calculation through angular relationships, eliminating the need for additional EFTEM hardware while providing size information.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick, direct, and accurate measurement of sample sizes below 100 nm without damaging the sample, using a straightforward formula to derive the size from optimized parameters, improving upon existing methods by simplifying the process and avoiding sample destruction.
Implementation Method 1
the first apparatus parameter of the measuring apparatus is so well adjusted with the help of an energy source, to obtain a first optimized value
Data Source
AI summary
A method for measuring a size of a specimen is provided. A first projected width of the specimen is obtained at a first angle with the help of an energy source then a second projected width of the specimen is obtained at a second angle with the help of the energy source. The first projected width, the first angle, the second projected width and the second angle are co-related to indirectly obtain a size of the specimen which has not been measured. The un-measured size is not directly involved with the first projected width and the second projected width.