Temperature Control Device with Dynamic Contact Pressure
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Solution Overview
Problem
Existing temperature control devices for processing target objects in semiconductor manufacturing struggle with accurate temperature control due to limited contact states between the heater and cooling plates, leading to reduced processing throughput.
Innovation Solution
A temperature control device with a moving stage, a cooling body, and a driving plate system that adjusts contact pressure and thermal resistance by moving the driving plate up and down, allowing for precise control of heat transfer between the stage and the cooling body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the heater plate and cooling plate are in contact only by tare weight, then the device structure is simple, but the temperature control accuracy is insufficient
Solution Approach 1:
The patent makes the contact state between the heater plate and cooling plate dynamically adjustable rather than fixed. By introducing a pressing mechanism that can apply variable pressing forces, the system transitions from a static tare-weight-only contact to a dynamic contact state where the pressing force can be adjusted based on processing requirements, thereby improving temperature control accuracy without excessive structural complexity
Solution Approach 2:
The patent changes the physical parameter of contact pressure between the heater plate and cooling plate. By introducing a pressing mechanism that can apply controlled pressing forces, the contact pressure parameter becomes variable rather than fixed at tare weight only. This parameter change enables precise control of thermal contact resistance, improving temperature control accuracy while maintaining reasonable device complexity
2Productivity
If separate apparatuses are used for heating and cooling, then each apparatus can be optimized for its function, but the processing throughput is reduced due to transfer time
Solution Approach 1:
The patent merges the heating function and cooling function into a single integrated apparatus. The heater plate and cooling plate are positioned adjacent to each other within the same processing chamber, allowing the processing target object to be heated or cooled without physical transfer between separate apparatuses, thereby eliminating transfer time and improving processing throughput
Solution Approach 2:
The patent creates a multi-functional apparatus that can perform both heating and cooling operations. The system uses a heater plate for heating and a cooling plate for cooling, both integrated within the same processing chamber and controlled by a unified system, enabling the single apparatus to fulfill multiple thermal processing functions
3Speed
If the heater plate is moved up and down to control contact, then the temperature control response is fast, but the contact pressure control is insufficient
Solution Approach 1:
The patent introduces a dynamic pressing mechanism that can apply variable pressing forces to the heater plate. This pressing mechanism works in conjunction with the up-and-down movement to provide both rapid response and precise contact pressure control. The pressing force can be adjusted independently of the plate position, enabling fine-tuned control of thermal contact resistance
Solution Approach 2:
The patent introduces a pressing mechanism as an intermediary element between the heater plate and cooling plate. This pressing mechanism mediates the contact between the two plates by applying controlled forces, enabling independent control of contact pressure separate from the plate position. The intermediary pressing mechanism provides precise pressure control while maintaining fast response through coordinated movement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature control and improved processing throughput by allowing for rapid heating and cooling of the processing target object within the same apparatus, reducing the time required to reach target temperatures.
Implementation Method 1
heat of the heater plate is absorbed by the cooling plate, so that the processing target object on the heater plate is cooled
Implementation Method 2
The heater plate is provided with a thin film heater, and the processing target object is placed on a top surface of the heater plate
Data Source
AI summary
A temperature control device includes a moving stage allowed to be heated and configured to mount a processing target object on a top surface thereof; a cooling body allowed to be cooled and fixed at a position under the moving stage; a shaft, having one end connected to the moving stage; the other end positioned under the cooling body; a first flange provided at the other end; and a second flange provided between the first flange and the cooling body, extended between the one end and the other end; a driving plate, provided between the first flange and the second flange, having a top surface facing the second flange and a bottom surface opposite to the top surface; an elastic body provided between the bottom surface of the driving plate and the first flange; and a driving unit configured to move the driving plate up and down.