Temperature-Controlled Cylindrical Roll for Putty Smoothing

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Solution Overview

Problem

Existing methods for smoothing putty on plywood panels are inefficient due to the high stickiness and difficulty in spreading, leading to residual putty issues and tool contamination, which causes problems during panel stacking and processing.

Innovation Solution

A temperature-controlled cylindrical roll apparatus mounted on a 3D-portal mechanism for precise movement, with a scraper to remove excess putty, allowing for controlled temperature adjustment between -5°C to 60°C to manage putty viscosity and adherence.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If highly sticky putty is used to fill defects, then the putty is resistant to wear and damages when set, but the putty becomes difficult to smooth and scrape from the surface

Engineering Contradiction:
Improvewear resistanceVSAvoidsmoothability
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent applies parameter changes by controlling the temperature of the putty during smoothing. The putty is heated to a temperature range of 20-60°C, which changes its physical state from a hard, sticky material to a more pliable state that is easier to smooth. This temperature parameter change allows the putty to maintain its wear-resistant properties when set while becoming easier to work with during the smoothing process

Inventive Principle:
Principle #35Parameter changes

2Strength

If highly sticky putty is used to fill defects, then the putty is resistant to wear and damages when set, but residual putty remains on the sides of the defect or rises above the surface

Engineering Contradiction:
Improvewear resistanceVSAvoidsurface flatness
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent uses temperature parameter changes to control putty behavior during smoothing. By heating the putty to 20-60°C, it becomes more pliable and can be smoothed to a precise, flat surface. The temperature control ensures the putty maintains optimal consistency for achieving surface flatness while still providing wear resistance when set

Inventive Principle:
Principle #35Parameter changes

3Strength

If highly sticky putty is used to fill defects, then the putty is resistant to wear and damages when set, but the unset putty soils and glues stacked panels together

Engineering Contradiction:
Improvewear resistanceVSAvoidpanel contamination
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by controlling putty temperature during the smoothing and stacking process. The putty is heated to 20-60°C to reduce its stickiness and prevent it from adhering to adjacent panels. This temperature control eliminates the harmful effect of panel contamination while preserving the wear-resistant properties of the set putty

Inventive Principle:
Principle #35Parameter changes

4Strength

If highly sticky putty is used to fill defects, then the putty is resistant to wear and damages when set, but the putty sticks easily to smoothing tools and clothes

Engineering Contradiction:
Improvewear resistanceVSAvoidtool contamination
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent uses parameter changes by heating the putty to a temperature range of 20-60°C during smoothing operations. This temperature increase changes the putty's physical properties, reducing its excessive stickiness and making it easier to smooth without adhering to tools or operator clothing, while still maintaining wear resistance when set

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively smooths putty on plywood panels, preventing residual issues and tool contamination, ensuring smooth panel stacking and processing by maintaining optimal putty consistency and temperature.

Implementation Method 1

a liquid passage within the cylindrical roll for circulating liquid through the cylindrical roll for controlling the surface temperature of the cylindrical roll

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4406697A1Method and apparatus for smoothing putty
Publication Date: 2024.07.31 KOSKISEN OYJ
  • EP4406697A1 patent drawingFigure 1
  • EP4406697A1 patent drawingFigure 2
  • EP4406697A1 patent drawingFigure 3

AI summary

According to an example aspect of the present invention, there is provided an apparatus and a method for smoothing putty on plywood panel (10. The apparatus comprises a frame (12), a smoothing instrument (13) mounted on the frame (12, and elements (8, 9) connected to the frame (12) for supporting the weight of the smoothing apparatus. Further, cylindrical roll (13) mounted rotatably on the frame (12) as a smoothing instrument and an actuator (14) for rotating the cylindrical roll (13) and a liquid passage (18) within the cylindrical roll (13) for circulating liquid through the cylindrical roll (13) for controlling the surface temperature of the cylindrical roll (13) are arranged.